Datasheet > KBU8D

KBU8D

更新时间： 2024-01-02 21:03:27

品牌	Logo	应用领域
DAESAN		二极管
页数	文件大小	规格书
2页	181K
描述
CURRENT 8.0 Amperes VOLTAGE 50 to 1000 Volts

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中文翻译

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技术参数
数据手册

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KBU8D 技术参数

生命周期：	Obsolete	Reach Compliance Code：	unknown
ECCN代码：	EAR99	风险等级：	5.84
Base Number Matches：	1

KBU8D 数据手册

CURRENT 8.0 Amperes

VOLTAGE 50 to 1000 Volts

KBU8A THRU KBU8M

Features

· Low Forward Voltage Drop, High Current Capability

· Surge Overload Rating to 300A Peak

· Ideal for Printed Circuit Board Applications

· Case to Terminal Isolation Voltage 1500V

· Plastic Material - UL Flammability

Classification Rating 94V-0

~ ~

Mechanical Data

· Case : Molded Plastic

· Terminals : Plated Leads Solderable per

MIL-STD-202, Method 208

· Polarity : As Marked on Case

· Mounting : Through Hole for #6 Screw

· Mounting Torque : 5.0 Inch-pounds Maximum

· Weight : 8.0 grams (approx.)

K B U

Dim

Min

22.70

3.80

4.20

1.70

10.30

4.50

4.80

Max

Dim

Min

25.40

Max

23.70

4.10

4.70

2.20

11.30

6.80

5.80

19.30

17.80

7.10

16.80

6.60

4.70

1.20

5.20

1.30

· Marking : Type Number

All Dimens ions in mm

Maximum Ratings And Electrical Characteristics

(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive

load. For capacitive load, derate by 20%)

KBU

Symbols

Units

Peak Repetitive Reverse voltage

Working Peak Reverse voltage

DC Blocking voltage

RMM

RWM

100

200

140

400

600

420

800

560

1000

700

Volts

RMS Reverse voltage

RMS

280

8.0

Volts

Average Rectified Output Current @ T

=100

Amps

℃

Non-Repetitive Peak Forward Surge Current,

8.3ms single half-sine-wave superimposed

on rated load (JEDEC method)

IFSM

300

Amps

VFM

1.0

Volts

Forward voltage (per element)

@ IF=4.0 A

@ T

=25℃

=125℃

1.0

μA

Peak Reverse Current at Rated

DC Blocking voltage

@ TC

I²t Rating for Fusing (Note 2)

I²t

373

A²

Typical Thermal Resistance,

Junction to Case (Note 1)

7.5

℃/W

RθJA

STG

Operating and Storage Temperature Range

-65 to +150

℃

Notes:

(1) Thermal resistance junction to case mounted on heat sink.

(2) Non-repetitive, for t > 1.0ms and t < 8.3ms.

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