Table of Contents
1 Ordering parts...........................................................................3
5.3.2 Thermal attributes.................................................18
6 Peripheral operating requirements and behaviors....................19
6.1 Core modules....................................................................19
6.1.1 Debug trace timing specifications.........................19
6.1.2 JTAG electricals....................................................20
6.2 System modules................................................................23
6.3 Clock modules...................................................................23
6.3.1 MCG specifications...............................................23
6.3.2 Oscillator electrical specifications.........................26
6.3.3 32kHz Oscillator Electrical Characteristics............28
6.4 Memories and memory interfaces.....................................28
6.4.1 Flash (FTFL) electrical specifications....................29
6.4.2 EzPort Switching Specifications............................30
6.4.3 Flexbus Switching Specifications..........................31
6.5 Security and integrity modules..........................................33
6.6 Analog...............................................................................33
6.6.1 ADC electrical specifications.................................33
6.6.2 CMP and 6-bit DAC electrical specifications.........41
6.6.3 12-bit DAC electrical characteristics.....................44
6.6.4 Voltage reference electrical specifications............47
6.7 Timers................................................................................48
6.8 Communication interfaces.................................................48
6.8.1 CAN switching specifications................................49
6.8.2 DSPI switching specifications (low-speed mode)..49
6.8.3 DSPI switching specifications (high-speed mode) 50
6.8.4 I2C switching specifications..................................52
6.8.5 UART switching specifications..............................52
6.8.6 SDHC specifications.............................................52
6.8.7 I2S switching specifications..................................53
6.9 Human-machine interfaces (HMI)......................................55
6.9.1 TSI electrical specifications...................................55
7 Dimensions...............................................................................56
7.1 Obtaining package dimensions.........................................56
8 Pinout........................................................................................56
8.1 K10 Signal Multiplexing and Pin Assignments..................56
8.2 K10 Pinouts.......................................................................61
9 Revision History........................................................................62
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4 Ratings......................................................................................8
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................10
5.1 Nonswitching electrical specifications...............................10
5.1.1 Voltage and current operating requirements.........10
5.1.2 LVD and POR operating requirements.................11
5.1.3 Voltage and current operating behaviors..............11
5.1.4 Power mode transition operating behaviors..........12
5.1.5 Power consumption operating behaviors..............13
5.1.6 EMC radiated emissions operating behaviors.......16
5.1.7 Designing with radiated emissions in mind...........17
5.1.8 Capacitance attributes..........................................17
5.2 Switching specifications.....................................................17
5.2.1 Device clock specifications...................................17
5.2.2 General switching specifications...........................17
5.3 Thermal specifications.......................................................18
5.3.1 Thermal operating requirements...........................18
K10 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Freescale Semiconductor, Inc.
Preliminary
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