Datasheet > IT3D-180P-17H03

IT3D-180P-17H03

更新时间： 2022-12-23 02:16:16

品牌	Logo	应用领域
广濑 - HRS		连接器
页数	文件大小	规格书
20页	1602K
描述
High-Speed(10+Gbps) BGA Mezzanine Connectors

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IT3D-180P-17H03 数据手册

IT3 SeriesꢀHigh-Speed(10⁺Gbps) BGA Mezzanine Connectors

ꢀOrdering Information

ꢀReceptacle

(

)

IT 3 ** - *** S - BGA ** **

ꢀInterposer

(

)

IT 3 ** - *** P - ** H ** **

Series name : IT3

Receptacle Type

BGA : Ball Grid Array

Package Specification

Blank : Standard

: Mating Receptacle

D* : Mating Receptacle ( Customized )

: Mounting Receptacle

** : Customized

Material and Plating Specification of Receptacle

(37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)

Contact Area : Au(0.76µm)+Ni(1.5µm)

(57) : Eutectic Solder Sn(63)-Pb(37)

M* : Mounting Receptacle ( Coustomized )

Interposer Type

Blank: Standard

** : Customized

Contact Area : Au(0.76µm)+Ni(1.5µm)

Contact Positions : 100, 180^*, 200, 300

*180 pos. is 2 columns depopulated version for

higher voltage proof.

Connector type

S : Receptacle

P : Interposer

Stacking Height (mm)

17, 20, 22, 25, 26, 28, 30, 32, 38, 40

Plating Specification of Interposer

(03) : Contact Area : Au(0.76µm)+Ni(1.5µm)

1 234 5 6 7...20

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