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ISD1750XY01 PDF预览

ISD1750XY01

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
24页 351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

ISD1750XY01 数据手册

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ISD1700 SERIES  
TABLE OF CONTENTS  
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3  
FEATURES......................................................................................................................................4  
BLOCK DIAGRAM...........................................................................................................................5  
PINOUT CONFIGURATION............................................................................................................6  
PIN DESCRIPTION .........................................................................................................................7  
MODES OF OPERATIONS.............................................................................................................8  
6.1 Standalone (Push-Button) Mode .............................................................................................8  
6.2 SPI Mode .................................................................................................................................8  
7
TIMING DIAGRAMS........................................................................................................................8  
7.1 Standalone Operation..............................................................................................................8  
7.2 SPI Operation.........................................................................................................................12  
8
9
ABSOLUTE MAXIMUM RATINGS................................................................................................13  
8.1 Operating Conditions .............................................................................................................13  
ELECTRICAL CHARACTERISTICS .............................................................................................14  
9.1 DC Parameters ......................................................................................................................14  
9.2 AC Parameters.......................................................................................................................15  
10 TYPICAL APPLICATION CIRCUITS.............................................................................................16  
10.1 Good Audio Design Practices................................................................................................18  
11 PACKAGING .................................................................................................................................19  
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19  
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20  
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21  
11.4 Die Information.......................................................................................................................21  
12 ORDERING INFORMATION.........................................................................................................22  
13 VERSION HISTORY......................................................................................................................23  
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