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ISD1740PYI

更新时间： 2024-02-28 21:36:25

品牌	Logo	应用领域
华邦 - WINBOND		音频合成器集成电路消费电路
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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技术参数
数据手册

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ISD1740PYI 技术参数

生命周期：	Active	包装说明：	,
Reach Compliance Code：	compliant	风险等级：	5.21
Base Number Matches：	1

ISD1740PYI 数据手册

ISD1700 SERIES

Temperature options:

Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)

Industrial: -40°C to +85°C (packaged units)

Packaging types: available in die, PDIP, SOIC and TSOP

Package option: Lead-free packaged units

3 BLOCK DIAGRAM

Internal

Clock

Sampling

Clock

Timing

R_OSC

AnaIn

AUD /

Amp

AUX

Amp

Anti-

Aliasing

Filter

Nonvolatile

Multi-Level Storage

Array

SP+

Smoothing

Filter

Volume

Amp

Control

MIC+

AGC

SP-

Amp

MIC-

Automatic

Gain Control

AGC

SPI Interface

Device Control

Power Conditioning

V_SSA

V_CCP

V_SSDV_CCD

_SSP1V_SSP2

V_CCA

REC PLAY ERASE FWD

RESET VOL INT/RDY LED SS SCLK MOSI MISO

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 5 -

1 2 3 456 7 8...24

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ISD1740PYI01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
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ISD1740PYIR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1740PYR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1740PYR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1740SY	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格