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ISD17210PY

更新时间： 2024-01-07 16:22:35

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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获取价格

技术参数
数据手册

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ISD17210PY 技术参数

生命周期：	Transferred	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.7
Base Number Matches：	1

ISD17210PY 数据手册

ISD1700 SERIES

Temperature options:

Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)

Industrial: -40°C to +85°C (packaged units)

Packaging types: available in die, PDIP, SOIC and TSOP

Package option: Lead-free packaged units

3 BLOCK DIAGRAM

Internal

Clock

Sampling

Clock

Timing

R_OSC

AnaIn

AUD /

Amp

AUX

Amp

Anti-

Aliasing

Filter

Nonvolatile

Multi-Level Storage

Array

SP+

Smoothing

Filter

Volume

Amp

Control

MIC+

AGC

SP-

Amp

MIC-

Automatic

Gain Control

AGC

SPI Interface

Device Control

Power Conditioning

V_SSA

V_CCP

V_SSDV_CCD

_SSP1V_SSP2

V_CCA

REC PLAY ERASE FWD

RESET VOL INT/RDY LED SS SCLK MOSI MISO

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 5 -

1 2 3 456 7 8...24

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与ISD17210PY相关器件

型号	品牌	描述	获取价格	数据表
ISD17210PY01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210PYI	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210PYI01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210PYIR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210PYIR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210PYR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格