生命周期: | Active | 包装说明: | BGA, BGA672,26X26,40 |
Reach Compliance Code: | compliant | 风险等级: | 5.7 |
JESD-30 代码: | S-PBGA-B672 | 长度: | 27 mm |
可配置逻辑块数量: | 2831 | 输入次数: | 416 |
逻辑单元数量: | 75000 | 输出次数: | 416 |
端子数量: | 672 | 最高工作温度: | 85 °C |
最低工作温度: | 组织: | 2831 CLBS | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA672,26X26,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
座面最大高度: | 2.7 mm | 最大供电电压: | 1.13 V |
最小供电电压: | 1.07 V | 标称供电电压: | 1.1 V |
表面贴装: | YES | 温度等级: | COMMERCIAL EXTENDED |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 27 mm |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
5AGXFA1H4F27I5N | INTEL | Field Programmable Gate Array, 622MHz, PBGA672, ROHS COMPLIANT, FBGA-672 |
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5AGXFA1H4F31C6N | INTEL | Field Programmable Gate Array, 500MHz, PBGA896, ROHS COMPLIANT, FBGA-896 |
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5AGXFA1H6F27C5 | INTEL | Field Programmable Gate Array, 622MHz, PBGA672, FBGA-672 |
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5AGXFA1H6F27I3 | INTEL | Field Programmable Gate Array, 670MHz, PBGA672, FBGA-672 |
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5AGXFA1H6F31C4 | INTEL | Field Programmable Gate Array, 670MHz, PBGA896, FBGA-896 |
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5AGXFA1H6F31I3 | INTEL | Field Programmable Gate Array, 670MHz, PBGA896, FBGA-896 |
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