是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | QFP | 包装说明: | FQFP, QFP208,1.2SQ,20 |
针数: | 208 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.8 |
应用程序: | ATM | JESD-30 代码: | S-PQFP-G208 |
JESD-609代码: | e0 | 长度: | 28 mm |
功能数量: | 1 | 端子数量: | 208 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FQFP |
封装等效代码: | QFP208,1.2SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, FINE PITCH | 峰值回流温度(摄氏度): | 225 |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 3.45 mm | 子类别: | ATM/SONET/SDH ICs |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 电信集成电路类型: | ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 28 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
IDT77211L155PQF8 | IDT | ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 |
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IDT77211L155PQF9 | IDT | ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 |
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IDT77222L155DUI | IDT | ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, 28 X 28 MM, PLASTIC, QFP-20 |
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IDT77222L155PG8 | IDT | ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 |
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IDT77222L155PG9 | IDT | ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 |
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IDT77222L155PGI | IDT | ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 |
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