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IBM25EMPPC750DBUB2660 PDF预览

IBM25EMPPC750DBUB2660

更新时间: 2024-01-20 12:23:33
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟外围集成电路
页数 文件大小 规格书
44页 514K
描述
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360

IBM25EMPPC750DBUB2660 技术参数

是否Rohs认证: 不符合生命周期:Contact Manufacturer
零件包装代码:BGA包装说明:BGA, BGA360,19X19,50
针数:360Reach Compliance Code:unknown
ECCN代码:3A001.A.3HTS代码:8542.31.00.01
风险等级:5.41地址总线宽度:32
位大小:32边界扫描:YES
最大时钟频率:83.3 MHz外部数据总线宽度:64
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:S-CBGA-B360JESD-609代码:e0
长度:25 mm低功率模式:YES
端子数量:360封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:BGA封装等效代码:BGA360,19X19,50
封装形状:SQUARE封装形式:GRID ARRAY
电源:2.6,3.3 V认证状态:Not Qualified
座面最大高度:3.2 mm速度:266 MHz
子类别:Microprocessors最大供电电压:2.7 V
最小供电电压:2.5 V标称供电电压:2.6 V
表面贴装:YES技术:CMOS
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
宽度:25 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

IBM25EMPPC750DBUB2660 数据手册

 浏览型号IBM25EMPPC750DBUB2660的Datasheet PDF文件第2页浏览型号IBM25EMPPC750DBUB2660的Datasheet PDF文件第3页浏览型号IBM25EMPPC750DBUB2660的Datasheet PDF文件第4页浏览型号IBM25EMPPC750DBUB2660的Datasheet PDF文件第5页浏览型号IBM25EMPPC750DBUB2660的Datasheet PDF文件第6页浏览型号IBM25EMPPC750DBUB2660的Datasheet PDF文件第7页 
3/98  
Rev 1.0  
Advance Information  
TM  
PowerPC 740TMand PowerPC 750 Embedded  
Microprocessor: Hardware Specifications  
TM  
TM  
Th e PowerPC 740  
an d PowerPC 750  
m icroprocessors are im plem en tation s of th e  
TM  
PowerPC  
fam ily of redu ced in stru ction set com pu ter (RISC) m icroprocessors. In th is  
docu m en t, th e term PPC750” is u sed as an abbreviation for th e ph rase PowerPC  
TM  
750  
m icroprocessor, an d th e term PPC740” is u sed as an abbreviation for th e  
TM  
ph rase PowerPC 740  
m icroprocessor.” Th is docu m en t con tain s pertin en t ph ysical  
ch aracteristics of th e PPC740 an d PPC750.  
Th is docu m en t con tain s th e followin g topics:  
Topic  
Page  
Section 1.0, “Overview“............................................................................... 1  
Section 2.0, “Features“ ............................................................................... 2  
Section 3.0, “General Parameters“ ............................................................. 5  
Section 4.0, “PPC740 and PPC750 Microprocessor Pin Assignments“ ..... 20  
Section 5.0, “PPC740 and PPC750 Microprocessor Pinout Listings“......... 22  
Section 7.0, “PPC740 and PPC750 Microprocessor Package Description“ 28  
Section 8.0, “System Design Information“ .................................................. 34  
Section 9.0, “Ordering Information“............................................................. 45  
The PowerPC name, the PowerPC logotype, PowerPC 750 and PowerPC 740 are trademarks of International Business Machines Corporation.  
This document contains information on a new product under development by IBM. IBM reserves the right to change or discontinue this product  
without notice.  
© IBM Corporation, 1997  
Portions hereof © International Business Machines Corporation, 1991-1997. All rights reserved.  
1.0 Overview  
Th e PPC740 an d PPC750 are targeted for h igh perform an ce, low power system s an d  
Preliminary and subject to change without notice  
 

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