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IBM0436A4CBLBB-3P PDF预览

IBM0436A4CBLBB-3P

更新时间: 2024-02-11 04:40:14
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟静态存储器内存集成电路
页数 文件大小 规格书
26页 145K
描述
Standard SRAM, 128KX36, 1.7ns, CMOS, PBGA153, BGA-153

IBM0436A4CBLBB-3P 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:BGA, BGA153,9X17,50针数:153
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:1.7 ns最大时钟频率 (fCLK):333 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B153
JESD-609代码:e0长度:22 mm
内存密度:4718592 bit内存集成电路类型:STANDARD SRAM
内存宽度:36功能数量:1
端子数量:153字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:
组织:128KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA153,9X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.8,2.5 V
认证状态:Not Qualified座面最大高度:2.679 mm
最大待机电流:0.15 A最小待机电流:2.38 V
子类别:SRAMs最大压摆率:0.69 mA
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

IBM0436A4CBLBB-3P 数据手册

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.
IBM0418A8CBLBB IBM0436A8CBLBB  
IBM0418A4CBLBB IBM0436A4CBLBB  
Preliminary  
8Mb (256Kx36 & 512Kx18) and 4Mb (128Kx36 & 256Kx18)  
Features  
• 8Mb: 256K x 36 or 512K x 18 Organizations  
4Mb: 128K x 36 or 256K x 18 Organizations  
• HSTL Input and Output levels  
• Registered Addresses, Controls and Data Ins  
• Burst Mode of operation  
• CMOS Technology  
• Double Data Rate and Single Data Rate Syn-  
chronous Modes of Operation  
• Common I/O  
• Asynchronous Output Enable  
• Pipeline Mode of Operation  
• Boundary Scan using limited set of JTAG  
1149.1 functions  
• Self-Timed Late Write with Full Data Coherency  
• Single Differential HSTL Clock  
• 9 x 17 Bump Ball Grid Array Package with  
SRAM JEDEC Standard Pinout and Boundary  
SCAN Order  
• +2.5V Power Supply, Ground, 1.9V VDDQ, and  
0.95V VREF  
• Programmable Impedance Output Drivers  
• PBGA Package  
Description  
The IBM0436A4CBLBB, IBM0418A4CBLBB,  
IBM0418A8CBLBB, and IBM0436A8CBLBB  
clock, all Addresses, Controls, and Data Ins are reg-  
istered internally. Data Outs are updated from out-  
put registers off the next rising and falling edge of  
the K clock, hence the Double Data Rate. Internal  
Write buffers allow write data to follow one cycle  
after addresses and controls. The chip is operated  
with a single +2.5V power supply and is compatible  
with HSTL I/O interfaces.  
SRAMS are Synchronous Pipeline Mode, high-per-  
formance CMOS Static Random Access Memories  
that are versatile, have wide I/O, and achieve 3.0ns  
cycle times. Differential CK clocks are used to ini-  
tiate the read/write operation and all internal opera-  
tions are self-timed. At the rising edge of the CK  
cddrh2519.04  
12/00  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
Page 1 of 26  

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