P1818/19/20/21/22
®
Mechanical Package Outline (8-Pin SOIC)
Inches
Nor
Millimeters
Symbol
C
Min
Max
Min
Nor
Max
L
A
A1
A2
B
0.057 0.064 0.071 1.45
0.004 0.007 0.010 0.10
0.053 0.061 0.069 1.35
0.012 0.016 0.020 0.31
1.63
0.18
1.80
0.25
1.75
0.51
0.25
5.12
4.15
P18xxx
LOT NUMBER
E
H
1.55
YYWW
0.41
C
D
E
0.004 0.006 0.01
0.10
0.15
a
0.186 0.194 0.202 4.72
0.148 0.156 0.164 3.75
0.050 BSC
4.92
D
3.95
e
1.27 BSC
6.00
A
A2
A1
H
L
0.224 0.236 0.248 5.70
0.012 0.020 0.028 0.30
6.30
0.70
8°
0.50
B
e
a
0°
5°
8°
0°
5°
Note: Controlling dimensions are millimeters.
SOIC: 0.074 grams unit weight.
Mechanical Package Outline (8-Pin TSSOP)
Inches
Millimeters
Nor
Symbol
C
Min
Nor
Max
Min
Max
A
A1
A2
B
–
–
–
0.047
–
–
–
1.10
0.15
1.05
0.30
0.20
3.10
4.50
L
0.002
0.006 0.05
H
E
0.031 0.039 0.041 0.80
1.00
–
0.007
0.004
–
–
0.012 0.19
0.008 0.09
C
D
E
–
a
0.114 0.118 0.122 2.90
0.169 0.173 0.177 4.30
0.026 BSC
3.00
4.40
0.65 BSC
6.40
0.60
–
D
e
A
A2
A1
H
L
0.244 0.252 0.260 6.20
0.018 0.024 0.030 0.45
6.60
0.75
8°
B
e
a
0°
–
8°
0°
Note: Controlling dimensions are millimeters.
TSSOP: 0.034 grams unit weight.
March 2003
7 of 8
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.