Datasheet > I17180PYI

I17180PYI

更新时间： 2024-01-18 02:53:38

品牌	Logo	应用领域
华邦 - WINBOND		光电二极管商用集成电路
页数	文件大小	规格书
24页	351K
描述
Speech Synthesizer With RCDG, 360s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

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技术参数
数据手册

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I17180PYI 技术参数

生命周期：	Obsolete	零件包装代码：	DIP
包装说明：	DIP,	针数：	28
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.84	商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：	R-PDIP-T28	JESD-609代码：	e3
长度：	36.83 mm	功能数量：	1
端子数量：	28	片上内存类型：	FLASH
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	DIP
封装形状：	RECTANGULAR	封装形式：	IN-LINE
认证状态：	Not Qualified	最长读取时间：	360 s
座面最大高度：	4.83 mm	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	2.4 V	表面贴装：	NO
温度等级：	INDUSTRIAL	端子面层：	MATTE TIN
端子形式：	THROUGH-HOLE	端子节距：	2.54 mm
端子位置：	DUAL	宽度：	15.24 mm
Base Number Matches：	1

I17180PYI 数据手册

ISD1700 SERIES

TABLE OF CONTENTS

GENERAL DESCRIPTION..............................................................................................................3

FEATURES......................................................................................................................................4

BLOCK DIAGRAM...........................................................................................................................5

PINOUT CONFIGURATION............................................................................................................6

PIN DESCRIPTION .........................................................................................................................7

MODES OF OPERATIONS.............................................................................................................8

6.1 Standalone (Push-Button) Mode .............................................................................................8

6.2 SPI Mode .................................................................................................................................8

TIMING DIAGRAMS........................................................................................................................8

7.1 Standalone Operation..............................................................................................................8

7.2 SPI Operation.........................................................................................................................12

ABSOLUTE MAXIMUM RATINGS................................................................................................13

8.1 Operating Conditions .............................................................................................................13

ELECTRICAL CHARACTERISTICS .............................................................................................14

9.1 DC Parameters ......................................................................................................................14

9.2 AC Parameters.......................................................................................................................15

10 TYPICAL APPLICATION CIRCUITS.............................................................................................16

10.1 Good Audio Design Practices................................................................................................18

11 PACKAGING .................................................................................................................................19

11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19

11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20

11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21

11.4 Die Information.......................................................................................................................21

12 ORDERING INFORMATION.........................................................................................................22

13 VERSION HISTORY......................................................................................................................23

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123 4 5 6 7...24

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与I17180PYI相关器件

型号	品牌	描述	获取价格	数据表
I17180PYIR	WINBOND	Speech Synthesizer With RCDG, 360s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	获取价格
I17180PYIR01	WINBOND	Speech Synthesizer With RCDG, 360s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	获取价格
I17180PYR01	WINBOND	Speech Synthesizer With RCDG, 360s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	获取价格
I17180SY01	WINBOND	Speech Synthesizer With RCDG, 360s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	获取价格
I17180SYI01	WINBOND	Speech Synthesizer With RCDG, 360s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	获取价格
I17180SYIR01	WINBOND	Speech Synthesizer With RCDG, 360s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	获取价格

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