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HY5V52AFP-HI PDF预览

HY5V52AFP-HI

更新时间: 2024-02-11 06:48:43
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器内存集成电路
页数 文件大小 规格书
47页 677K
描述
Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90

HY5V52AFP-HI 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FBGA, BGA90,9X15,32Reach Compliance Code:compliant
风险等级:5.84最长访问时间:5.4 ns
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PBGA-B90
内存密度:268435456 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:32端子数量:90
字数:8388608 words字数代码:8000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:8MX32封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA90,9X15,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
电源:3.3 V认证状态:Not Qualified
刷新周期:4096连续突发长度:1,2,4,8,FP
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.22 mA标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
Base Number Matches:1

HY5V52AFP-HI 数据手册

 浏览型号HY5V52AFP-HI的Datasheet PDF文件第2页浏览型号HY5V52AFP-HI的Datasheet PDF文件第3页浏览型号HY5V52AFP-HI的Datasheet PDF文件第4页浏览型号HY5V52AFP-HI的Datasheet PDF文件第5页浏览型号HY5V52AFP-HI的Datasheet PDF文件第6页浏览型号HY5V52AFP-HI的Datasheet PDF文件第7页 
256Mb Synchronous DRAM based on 2M x 4Bank x32 I/O  
256M (8Mx32bit) Hynix SDRAM  
Memory  
Memory Cell Array  
- Organized as 4banks of 2,097,152 x 32  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 1.0 / Dec. 2007  
1

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