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HTHA0805673R00QW

更新时间： 2024-02-23 07:42:12
品牌 Logo 应用领域
威世 - VISHAY 电阻器
页数 文件大小 规格书
7页 864K
描述
RES,SMT,METAL FOIL,673 OHMS,.02% +/-TOL,-2.5,2.5PPM TC,0805 CASE

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HTHA0805673R00QW 技术参数

是否Rohs认证： 符合生命周期：Contact Manufacturer
包装说明：SMT, 0805Reach Compliance Code：unknown
风险等级：5.66构造：Rectangular
端子数量：2最高工作温度：240 °C
最低工作温度：-55 °C封装高度：0.5 mm
封装长度：2.01 mm封装形状：RECTANGULAR PACKAGE
封装形式：SMT封装宽度：1.24 mm
包装方法：Waffle Pack额定功率耗散 (P)：0.02 W
电阻：673 Ω电阻器类型：FIXED RESISTOR
系列：HTHA尺寸代码：0805
子类别：FIXED RESISTOR技术：METAL FOIL
温度系数：-2.5,2.5 ppm/ °C容差：0.02%
Base Number Matches：1

HTHA0805673R00QW 数据手册

 浏览型号HTHA0805673R00QW的Datasheet PDF文件第1页浏览型号HTHA0805673R00QW的Datasheet PDF文件第2页浏览型号HTHA0805673R00QW的Datasheet PDF文件第3页浏览型号HTHA0805673R00QW的Datasheet PDF文件第4页浏览型号HTHA0805673R00QW的Datasheet PDF文件第6页浏览型号HTHA0805673R00QW的Datasheet PDF文件第7页 
HTHA (Z1-Foil)  
Vishay Foil Resistors  
Catastrophic Damage - occurs when the ESD event causes the  
device to immediately stop functioning. This may occur after one or  
a number of ESD events with diverse causes, such as human body  
discharge or the mere presence of an electrostatic field.  
PULSE TEST  
TEST DESCRIPTION  
All parts are baked at +125°C for 1 hour and allowed to cool at room  
temperature for 1 hour, prior to testing. By using an electrolytic  
0.01µF capacitor charged to 1200 VDC, a single pulse was  
performed on 30 units of 1206, 10 kof Surface Mount Vishay Foil  
resistor and Thin Film resistor. The unit was allowed time to cool  
down, after which the resistance measurement was taken and  
displayed in ppm deviation from the initial reading.  
Latent Damage - occurs when the ESD event causes moderate  
damage to the device, which is not noticeable, as the device appears  
to be functioning correctly. However, the load life of the device has  
been dramatically reduced, and further degradation caused by  
operating stresses may cause the device to fail during service.  
Latent damage is the source for greatest concern, since it is very  
difficult to detect by re-measurement or by visual inspection,  
because damage may have occurred under the external coating.  
TEST RESULTS  
FIGURE 3 - PULSE TEST DESCRIPTION  
TEST DESCRIPTION  
By using an electrolytic 500 pF capacitor charged up to 4500 V,  
pulses were performed on 10 units of 1206, 10 kof three different  
Surface Mount Chip Resistors technologies, with an initial voltage  
spike of 2500 V (Figure 5). The unit was allowed time to cool down,  
after which the resistance measurement was taken and displayed in  
ppm deviation from the initial reading. Readings were then taken in  
500 V increments up to 4500 V.  
ꢀ2!!  
#$ꢁ  
!ꢂ!ꢀ+-  
"*  
TEST RESULTS  
FIGURE 5 - ESD TEST DESCRIPTION  
2500 V to 4500 V  
1 MΩ  
FIGURE 4 - PULSE TEST RESULTS AT  
1200 VDC*  
140000  
120000  
100000  
500 pF  
Thin Film  
80000  
60000  
40000  
20000  
0
Bulk Metal® Foil  
Rx  
Size: 1206  
Value: 10K  
n = 30  
0
5
10  
15  
20  
25  
30  
-20000  
DMM  
Resistor #  
* Note: Average of 30 units yielded deviation of 30,723 ppm for the  
Thin Film vs. -14 ppm for the Bulk Metal® Foil  
TABLE 6 - ESD TEST RESULTS  
∆R (%)  
VOLTS  
THICK FILM  
-2.7  
THIN FILM  
97  
FOIL  
ELECTROSTATIC DISCHARGE (ESD)  
2500  
3000  
3500  
4000  
4500  
<0.005  
<0.005  
<0.005  
<0.005  
<0.005  
ESD can be categorized into three types of damages:  
-4.2  
366  
Parametric Failure - occurs when the ESD event alters one or more  
device parameters (resistance in the case of resistors), causing it to  
shift from its required tolerance. This failure does not directly pertain  
to functionality; thus a parametric failure may be present while the  
device is still functional.  
-6.2  
>5000  
>5000  
OPEN  
-7.4  
-8.6  
Document Number: 63222  
Revision: 20-Dec-11  
For any questions, contact: foil@vishaypg.com  
www.vishayfoilresistors.com  
5
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