Datasheet > HMC358

HMC358

更新时间： 2023-12-20 18:45:09

品牌	Logo	应用领域
亚德诺 - ADI		放大器缓冲放大器
页数	文件大小	规格书
6页	564K
描述
集成缓冲放大器的MMIC VCO SMT，5.8 - 6.8 GHz

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数据手册

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HMC358 数据手册

HMC358MS8G / 358MS8GE

v04.0607

MMIC VCO w/ BUFFER

AMPLIFIER, 5.8 - 6.8 GHz

Absolute Maximum Ratings

Typical Supply Current vs. Vcc

Vcc

3.5 Vdc

Vcc (V)

Icc (mA)

Storage Temperature

Operating Temperature

Vtune

-65 to +150 °C

-40 to +85 °C

0 to 11V

2.75

3.0

100

3.25

115

Note: VCO will operate over full voltage range shown above.

ESD Sensitivity (HBM)

Class 1A

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB RF GROUND.

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

MSL1 ^[1]

Package Marking ^[3]

H358

XXXX

HMC358MS8G

HMC358MS8GE

Low Stress Injection Molded Plastic

Sn/Pb Solder

H358

XXXX

MSL1 ^[2]

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

[1] Max peak reﬂow temperature of 235 °C

[2] Max peak reﬂow temperature of 260 °C

[3] 4-Digit lot number XXXX

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