Datasheet > HMC306MS10

HMC306MS10

更新时间： 2024-02-24 11:47:34

品牌	Logo	应用领域
亚德诺 - ADI		衰减器射频微波
页数	文件大小	规格书
6页	767K
描述
0.5 dB LSB 5-Bit Digital Attenuator SMT, 0.7 - 3.8 GHz

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技术参数
数据手册

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HMC306MS10 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	包装说明：	MINIATURE, PLASTIC, SMT, MSOP-10
针数：	10	Reach Compliance Code：	not_compliant
风险等级：	5.7	标称衰减：	15.5 dB
特性阻抗：	50 Ω	构造：	COMPONENT
最大输入功率 (CW)：	28.06 dBm	最大插入损耗：	2.7 dB
JESD-609代码：	e0	最大工作频率：	3800 MHz
最小工作频率：	700 MHz	最高工作温度：	85 °C
最低工作温度：	-40 °C	射频/微波设备类型：	VARIABLE ATTENUATOR
端子面层：	Tin/Lead (Sn85Pb15)	Base Number Matches：	1

HMC306MS10 数据手册

HMC306MS10 / 306MS10E

v06.0206

0.5 dB LSB GaAs MMIC 5-BIT DIGITAL

ATTENUATOR, 0.7 - 3.8 GHz

Absolute Maximum Ratings

Control Voltage (V1 - V5)

Vdd + 0.5 Vdc

Bias Voltage (Vdd)

+8.0 Vdc

Storage Temperature

-65 to +150 °C

-40 to +85 °C

+28 dBm

Operating Temperature

RF Input Power (0.7 - 3.8 GHz)

ESD Sensitivity (HBM)

Class 1A

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS].

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

MSL1 ^[1]

Package Marking ^[3]

H306

XXXX

HMC306MS10

Low Stress Injection Molded Plastic

Sn/Pb Solder

H306

XXXX

MSL1 ^[2]

HMC306MS10E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

[1] Max peak reﬂow temperature of 235 °C

[2] Max peak reﬂow temperature of 260 °C

[3] 4-Digit lot number XXXX

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

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