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HMC256_07 PDF预览

HMC256_07

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
HITTITE /
页数 文件大小 规格书
5页 135K
描述
GaAs MMIC I/Q MIXER 5.9 - 12 GHz

HMC256_07 数据手册

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HMC256  
v03.1007  
GaAs MMIC I/Q MIXER  
5.9 - 12 GHz  
Absolute Maximum Ratings  
RF / IF Input  
+13 dBm  
+27 dBm  
150 °C  
LO Drive  
Channel Temperature  
Continuous Pdiss (T = 85 °C)  
(derate 9.36 mW/°C above 85 °C)  
0.61 W  
3
Thermal Resistance (RTH  
(junction to die bottom)  
)
106.8 °C/W  
Storage Temperature  
Operating Temperature  
-65 to +150 °C  
-55 to +85 °C  
%,%#42/34!4)# 3%.3)4)6% $%6)#%  
/"3%26% (!.$,).' 02%#!54)/.3  
Outline Drawing  
Die Packaging Information [1]  
NOTES:  
1. ALL DIMENSIONS ARE IN INCHES [MM].  
2. BOND PADS ARE .004” SQUARE.  
Standard  
Alternate  
3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”.  
4. BACKSIDE METALLIZATION: GOLD.  
WP-3  
[2]  
[1] Refer to the “Packaging Information” section for die  
packaging dimensions.  
5. BOND PAD METALLIZATION: GOLD.  
6. BACKSIDE METAL IS GROUND.  
[2] For alternate packaging information contact Hittite  
Microwave Corporation.  
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
3 - 5  

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