HLMP-PB00-N0000/HLMP-PM00-N0000
HLMP-QB00-S0000/HLMP-QM00-S0000
SubminiatureBlue andGreen InGaN LED Lamps
DataSheet
Features
Description
• Subminiature flat top package
Flat Top Package
Ideal for backlighting and light piping applications
The HLMP-Pxxx flat top lamps use an untinted,
nondiffused, truncated lens to provide a wide radiation
pattern that is necessary for use in backlighting
applications. The flat top lamps are also ideal for use
as emitters in light pipe applications.
• Subminiature dome package
Nondiffused dome for high brightness
• Colors: 468 nm blue, 525 nm green
• Ideal for space limited applications
• Axialleads
Dome Package
The HLMP-Qxxx dome lamps use an untinted,
nondiffused lens to provide a high luminous intensity
within a narrow radiation pattern.
• Available with lead configurations for surface mount
and through hole PC board mounting
Applications
• Consumer
Lead Configurations
All these devices are made by encapsulating LED chip
on axiallead frames to form molded epoxysubminiature
lamps. A variety of package configuration options is
available. These include special surface mount lead
configurations, gull wing, yoke lead, or Z-bend. Right
angle lead bend at 2.54 mm (0.100 inch) and 5.08 mm
(0.200 inch) center spacing are available for through
hole mounting. For more information refer to Standard
SMT and Through Hole Lead Bend Options for
Subminiature Lamps data sheet.
• Industrial
• Computerperipheral
• Communication
CAUTION: HLMP-xB00 a nd HLMP-xM00 LEDs a re Cla ss 2 ESD sensitive. Plea se observe a ppropria te
preca utions during ha ndling a nd processing. Refer to Ava go Applica tion Note AN-1142 for a dditiona l
details.