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HFCT-5208AFM PDF预览

HFCT-5208AFM

更新时间： 2024-01-23 04:30:22
品牌 Logo 应用领域
安华高科 - AVAGO 光纤电信集成电路异步传输模式ATM
页数 文件大小 规格书
20页 412K
描述
1 x 9 Fiber Optic Transceivers for 622 Mb/s ATM/SONET/SDH Applications

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HFCT-5208AFM 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：ObsoleteReach Compliance Code：compliant
ECCN代码：5A991.B.5.AHTS代码：8517.62.00.50
风险等级：5.72主体宽度：29.6 mm
主体高度：11.89 mm主体长度或直径：39.6 mm
内置特性：AMPLIFIER通信标准：ATM, ITU-T-G.957, OC-12, SDH, SONET, STM-4
连接类型：SC CONNECTOR数据速率（接收）：622 Mbps
数据速率（发送）：622 Mbps发射极/检测器类型：LASER DIODE, PIN PHOTODIODE
光纤设备类型：TRANSCEIVER光纤类型：9/125, 62.5/125, SMF
JESD-609代码：e3安装特点：BOARD/PANEL MOUNT
最高工作温度：70 °C最低工作温度：
最大工作波长：1356 nm最小工作波长：1274 nm
标称工作波长：1313 nm标称光功率输出：0.007 mW
子类别：Fiber Optic Transceivers最大供电电压：5.25 V
最小供电电压：4.75 V标称供电电压：5 V
表面贴装：NO端子面层：Matte Tin (Sn)
Base Number Matches：1

HFCT-5208AFM 数据手册

 浏览型号HFCT-5208AFM的Datasheet PDF文件第3页浏览型号HFCT-5208AFM的Datasheet PDF文件第4页浏览型号HFCT-5208AFM的Datasheet PDF文件第5页浏览型号HFCT-5208AFM的Datasheet PDF文件第7页浏览型号HFCT-5208AFM的Datasheet PDF文件第8页浏览型号HFCT-5208AFM的Datasheet PDF文件第9页 
Both shielded design options connect only to the  
equipment chassis and not to the signal or logic ground of  
the circuit board within the equipment closure. The front  
panel aperture dimensions are recommended in Figures 9  
and 11. When layout of the printed circuit board is done to  
incorporate these metal-shielded transceivers, keep the area  
on the printed circuit board directly under the external  
metal shield free of any components and circuit board  
traces. For additional EMI performance advantage, use  
duplex SC fiber-optic connectors that have low metal  
content inside the connector. This lowers the ability of the  
metal fiber-optic connectors to couple EMI out through  
the aperture of the panel or enclosure.  
Recommended Solder and Wash Process  
The HFBR/HFCT-5208M is compatible with industry-  
standard wave or hand solder processes.  
HFBR-5000 Process Plug  
The HFBR/HFCT-5208M transceiver is supplied with a  
process plug, the HFBR-5000, for protection of the optical  
ports with the Duplex SC connector receptacle. This process  
plug prevents contamination during wave solder and  
aqueous rinse as well as during handling, shipping or  
storage. It is made of high-temperature, molded, sealing  
material that will withstand +85°C and a rinse pressure of  
2
110 lb/in .  
XXXX-XXXX  
KEY:  
ZZZZZ LASER PROD  
YYWW = DATE CODE  
21CFR(J) CLASS 1  
N.B. For shielded  
module the label  
is mounted on  
XXXX-XXXX = HFBR-5208M or HFCT-5208M  
COUNTRY OF ORIGIN YYWW  
ZZZZ = 1300 nm  
RX  
TX  
the end as  
shown.  
39.6  
(1.56)  
12.7  
(0.50)  
MAX.  
4.7  
(0.185)  
AREA  
RESERVED  
FOR  
25.4  
12.7  
MAX.  
(1.00)  
PROCESS  
PLUG  
(0.50)  
2.0 ± 0.1  
(0.079 ± 0.004)  
SLOT WIDTH  
2.5  
(0.10)  
SLOT DEPTH  
+0.1  
0.25  
-0.05  
+0.004  
-0.002  
(0.010  
)
9.8  
(0.386)  
MAX.  
0.51  
(0.020)  
3.3 ± 0.38  
(0.130 ± 0.015)  
20.32  
(0.800)  
15.8 ± 0.15  
(0.622 ± 0.006)  
+0.25  
-0.05  
0.46  
+0.25  
-0.05  
+0.010  
-0.002  
9X Ø  
+0.010  
-0.002  
1.27  
(0.018  
)
2X Ø  
(
0.050  
)
8X  
20.32  
(0.800)  
23.8  
(0.937)  
2.54  
(0.100)  
20.32  
(0.800)  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
TOLERANCES: X.XX ±0.025 mm  
X.X ±0.05 mm  
14.5  
(0.57)  
1.3  
(0.051)  
2X Ø  
UNLESS OTHERWISE SPECIFIED.  
Masked insulator material  
(no metalization)  
Figure 7. Package Outline Drawing for HFBR/HFCT-5208M  
6
1...3456789...20

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