Datasheet > HFBR2521

HFBR2521

更新时间： 2022-03-22 03:03:59

品牌	Logo	应用领域
惠普 - HP		光纤
页数	文件大小	规格书
19页	439K
描述
Versatile Link The Versatile Fiber Optic Connection

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数据手册

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HFBR2521 数据手册

when making connections.

Receivers are blue and transmit-

ters are gray, except for the

HFBR-15X3 transmitter, which is

black.

Versatile Link components are

moisture sensitive devices and

are shipped in a moisture sealed

bag. If the components are

exposed to air for an extended

period of time, they may require

a baking step before the solder-

ing process. Refer to the special

labeling on the shipping tube for

details.

Recommended Chemicals for

Cleaning/Degreasing

Alcohols: methyl, isopropyl,

isobutyl. Aliphatics: hexane,

heptane, Other: soap solution,

naphtha.

Handling

Versatile Link components are

auto-insertable. When wave

soldering is performed with

Versatile Link components, the

optical port plug should be left in

to prevent contamination of the

port. Do not use reflow solder

processes (i.e., infrared reflow or

vapor-phase reflow).

Nonhalogenated water soluble

fluxes (i.e., 0% chloride), not

rosin based fluxes, are recom-

mended for use with Versatile

Link components.

Do not use partially halogenated

hydrocarbons such as 1,1.1

trichloroethane, ketones such as

MEK, acetone, chloroform, ethyl

acetate, methylene dichloride,

phenol, methylene chloride, or N-

methylpyrolldone. Also, Agilent

does not recommend the use of

cleaners that use halogenated

hydrocarbons because of their

potential environmental harm.

Level

CAUTION

This bag contains

MOISTURE-SENSITIVE

DEVICES

1. Shelf life in sealed bag: 12 months at < 40°C and < 90% Relative

Humidity (RH).

2. After this bag is opened, devices that will be subjected to wave

soldering, or equivalent processing (solder temperature < 260°C for

10 sec) must be:

a) Mounted within 72 hours at factory conditions of ≤ 30°C/60% RH.

b) Stored at ≤ 20% RH.

3. Devices require baking, before mounting, if:

a) Desiccant changes to PINK.

b) If 2a or 2b are not met.

4. If baking is required, devices may be baked outside of tube for 20

hours at 75°C.

Bag Seal Date: ______________________________________________________

(If blank, see barcode label)

Note: LEVEL defined by EIA JEDEC Standard J-STD-020

Mechanical Dimensions

Horizontal Modules

Vertical Modules

2.0

(0.080)

6.8

(0.270)

10.2

(0.400)

5.1

7.6

(0.30)

18.8

(0.740)

(0.200)

4.2

(0.165)

0.64

(0.025)

18.8

0.740

7.71

(0.305)

(0.30)

7.6

3.81 (0.150) MAX.

3.56 (0.140) MIN.

7.62

(0.300)

1.27

(0.050)

0.51

(0.020)

2.5

(0.100)

0.64 (0.025) DIA.

1.85

(0.073)

2.8

(0.109)

1 234 5 6 7...19

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