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HFBR-5803TF PDF预览

HFBR-5803TF

更新时间: 2024-02-26 04:49:09
品牌 Logo 应用领域
安捷伦 - AGILENT 光纤异步传输模式以太网ATM
页数 文件大小 规格书
16页 251K
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HFBR-5803TF 数据手册

 浏览型号HFBR-5803TF的Datasheet PDF文件第4页浏览型号HFBR-5803TF的Datasheet PDF文件第5页浏览型号HFBR-5803TF的Datasheet PDF文件第6页浏览型号HFBR-5803TF的Datasheet PDF文件第8页浏览型号HFBR-5803TF的Datasheet PDF文件第9页浏览型号HFBR-5803TF的Datasheet PDF文件第10页 
Solder and Wash Process  
transceivers. Figure 7 provides a Board Layout - Art Work  
Compatibility  
good example of a schematic for  
a power supply decoupling  
circuit that works well with  
these parts. It is further  
recommended that a contiguous  
ground plane be provided in the  
circuit board directly under the  
transceiver to provide a low  
inductance ground for signal  
return current. This recommen-  
dation is in keeping with good  
high frequency board layout  
practices.  
The Applications Engineering  
The transceivers are delivered  
with protective process plugs  
inserted into the duplex SC or  
duplex ST connector receptacle.  
This process plug protects the  
optical subassemblies during  
wave solder and aqueous wash  
processing and acts as a dust  
cover during shipping.  
group has developed Gerber file  
artwork for a multilayer printed  
circuit board layout incorporat-  
ing the recommendations above.  
Contact your local Agilent sales  
representative for details.  
Board Layout - Mechanical  
For applications providing a  
choice of either a duplex SC or a  
duplex ST connector interface,  
while utilizing the same pinout  
on the printed circuit board, the  
ST port needs to protrude from  
These transceivers are compat-  
ible with either industry  
standard wave or hand solder  
processes.  
Board Layout - Hole Pattern  
The Agilent transceiver complies the chassis panel a minimum of  
Shipping Container  
with the circuit board “Common  
Transceiver Footprint” hole  
pattern defined in the original  
multisource announcement  
which defined the 1 x 9 package  
style. This drawing is repro-  
duced in Figure 8 with the  
9.53 mm for sufficient clearance  
to install the ST connector.  
The transceiver is packaged in a  
shipping container designed to  
protect it from mechanical and  
ESD damage during shipment or  
storage.  
Please refer to Figure 8a for a  
mechanical layout detailing the  
recommended location of the  
duplex SC and duplex ST trans-  
ceiver packages in relation to  
the chassis panel.  
Board Layout - Decoupling Circuit  
and Ground Planes  
It is important to take care in  
the layout of your circuit board  
to achieve optimum  
addition of ANSI Y14.5M  
compliant dimensioning to be  
used as a guide in the mechani-  
cal layout of your circuit board.  
performance from these  
2 x Ø 1.9 0.1  
(0.075 0.004)  
20.32  
(0.800)  
9 x Ø 0.8 0.1  
(0.032 0.004)  
20.32  
(0.800)  
2.54  
(0.100)  
TOP VIEW  
SIONS ARE IN MILLIMETERS (INCHES)  
DIMEN  
Figure 8. Recommended Board Layout Hole Pattern  
7

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