2
Receiver Sections
Figures 2b and 2c show the
outline drawings for options that
include mezzanine height and
extended and flush shields
respectively.
transceiver and do not require
connection to a ground plane on
the circuit board.
The receiver sections of the
HFBR-5204 and HFBR-5205
series utilize InGaAs PIN photo-
diodes coupled to a custom
silicon transimpedance preampli-
fier IC. These are packaged in the
optical subassembly portion of
the receiver.
The transceiver is attached to a
printed circuit board with the nine
signal pins and the two solder
posts which exit the bottom of the
housing. The two solder posts
provide the primary mechanical
strength to withstand the loads
imposed on the transceiver by
mating with the duplex or simplex
SC or ST connectored fiber
cables.
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
These PIN/preamplifier combina-
tions are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The data output is
differential. The signal detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL referenced
(shifted) to a +5 volt power
supply.
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board on which the
IC chips and various surface-
mounted passive circuit elements
are attached.
Note: The “T” in the product
numbers indicates a transceiver
with a duplex ST connector
receptacle. Product numbers
without a “T” indicate transceivers
with a duplex SC connector
receptacle.
The package includes internal
shields for the electrical and
optical subassemblies to insure
low EMI emissions and high
immunity to external EMI fields.
Package
ApplicationInformation
The overall package concept for
the Agilent transceivers consists
of three basic elements; the two
optical subassemblies, an
electrical subassembly, and the
housing as illustrated in the block
diagrams in Figure 1 and
Figure 1a.
The outer housing including the
duplex SC connector or the
The Applications Engineering
group in the Agilent Optical
Communication Division is
available to assist you with the
technical understanding and
design trade-offs associated with
these transceivers. You can con-
tact them through your Agilent
sales representative.
duplex ST ports is molded of filled
non-conductive plastic to provide
mechanical strength and electrical
isolation. The solder posts of the
Agilent design are isolated from
the circuit design of the
The package outline drawing and
pin out are shown in Figures 2,
2a, and 3. The details of this
package outline and pin out are
compliant with the multisource
definition of the 1x9 SIP. The low
profile of the Agilent transceiver
design complies with the
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DUPLEX SC
RECEPTACLE
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
maximum height allowed for the
duplex SC connector over the
entire length of the package.
SIGNAL
QUANTIZER IC
DETECT OUT
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1. SC Block Diagram.
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