HFBR-5112

更新时间： 2024-01-08 14:21:34

品牌	Logo	应用领域
安捷伦 - AGILENT		电信集成电路
页数	文件大小	规格书
16页	281K
描述
Low Cost, Industry Standard FDDI MIC Transceivers

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中文翻译

获取价格

技术参数
数据手册

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HFBR-5112 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	,	Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01	风险等级：	5.68
JESD-30 代码：	R-XXFO-X	功能数量：	1
最高工作温度：	70 °C	最低工作温度：
封装主体材料：	UNSPECIFIED	封装形状：	RECTANGULAR
封装形式：	FIBER OPTIC	峰值回流温度（摄氏度）：	NOT SPECIFIED
认证状态：	Not Qualified	标称供电电压：	5 V
表面贴装：	NO	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	COMMERCIAL	端子形式：	UNSPECIFIED
端子位置：	UNSPECIFIED	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

HFBR-5112 数据手册

FDDI PMD standard. Likewise,

the Fast Ethernet Alliance defines

the Physical Layer for the 100

Base-FX Version of IEEE 802.3u

to be the FDDI PMD standard.

differential. Also, both Data and

Signal Detect outputs are PECL

compatible, ECL referenced

Each transceiver package

includes internal shields for the

electrical and optical subassem-

blies to ensure low EMI emissions

and high immunity to external

EMI fields.

(shifted) to a +5 V power supply.

Hewlett-Packard also provides

several other FDDI products

compliant with the FDDI Low

Cost Fiber (LCF) -PMD and

Single Mode (SM) -PMD

standards. These products are

available with ST, SC, and FC

connector styles. They are

available in the 1x9 transceiver

and 14- and 16-pin transmitter/

receiver package styles for those

designs that require these

alternate configurations. Contact

your Hewlett-Packard sales

representative for information on

these alternative FDDI products.

The overall package concept for

the HP transceiver consists of the

following basic elements: two

optical subassemblies, an

electrical subassembly, and the

housing with full compliance to

the FDDI PMD standard. A block

diagram is illustrated in Figure 1.

The outer housings including the

MIC receptacles are molded of

filled non-conductive plastic to

provide mechanical strength and

electrical isolation. The solder

posts of each package design are

isolated from the circuit design of

the transceiver and do not require

connection to a ground plane on

the circuit board.

The package outline drawings

and pin-outs are shown in Figures

2 and 3. These are compliant with

the industry standard 2x11 and

1x13 pin configurations.

Each transceiver is attached to its

printed circuit boards with the

2x11 or 1x13 signal pins and the

solder posts which exit the

bottom of the housing. The solder

posts provide the primary

mechanical strength to withstand

the loads imposed on the

transceiver when mating with

MIC-connectored fiber cables.

The optical subassemblies utilize

a high-volume assembly process

together with low-cost lens

elements which result in a cost-

effective building block.

The transmitter section of the

HFBR-511X Series utilizes a 1300

nm surface emitting InGaAsP

LED. The LED is packaged in the

optical subassembly portion of

the transmitter section. It is dc-

coupled to a custom IC which

converts differential-input, PECL

logic signals, ECL referenced

(shifted) to a +5 V power supply,

into an analog LED drive current.

The electrical subassemblies

consist of a high-volume, multi-

layer printed circuit board on

which the IC chips and various

surface-mounted passive circuit

elements are attached.

The Applications Engineering

group of the Optical Communica-

tion Division is available to assist

you with the technical under

The receiver section of the

HFBR-511X Series utilizes an

InGaAs PIN photodiode coupled

to a custom silicon transimped-

ance preamplifier IC. They are

packaged in the optical sub-

assembly portion of the receiver.

ELECTRICAL SUBASSEMBLY

DIFFERENTIAL

DATA OUT

DIFFERENTIAL

SIGNAL

PIN PHOTODIODE

OPTICAL

QUANTIZER IC

DETECT OUT

PREAMP

TOP VIEW

SUBASSEMBLIES

The PIN/preamplifier combina-

tion is ac-coupled to a custom

quantizer IC which provides the

final pulse shaping for the logic

output and the Signal Detect

function. Both the Data and

Signal Detect outputs are

DIFFERENTIAL

DATA IN

LED

DRIVER IC

123 4 5 6 7...16

中文翻译

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与HFBR-5112相关器件

型号	品牌	获取价格	描述	数据表
HFBR-5112A	AVAGO	获取价格	Optoelectronic Device,
HFBR5112FDA	ETC	获取价格	FIBER OPTIC TRANSCEIVER
HFBR-5112FDA	AVAGO	获取价格	Telecom Circuit, 1-Func
HFBR5112FDB	ETC	获取价格	FIBER OPTIC TRANSCEIVER
HFBR-5112FDB	AGILENT	获取价格	暂无描述
HFBR5112FDM	ETC	获取价格	FIBER OPTIC TRANSCEIVER
HFBR-5112FDM	AVAGO	获取价格	SPECIALTY TELECOM CIRCUIT, XFO
HFBR5112FDN	ETC	获取价格	FIBER OPTIC TRANSCEIVER
HFBR-5112FDN	AVAGO	获取价格	Telecom Circuit, 1-Func
HFBR5112FDS	ETC	获取价格	FIBER OPTIC TRANSCEIVER

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