Datasheet > HEDS-6500

HEDS-6500

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
安华高科 - AVAGO		光电编码器
页数	文件大小	规格书
4页	113K
描述
Motion Sensing Products, Optical Encoder Modules

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HEDS-6500 数据手册

HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series

Motion Sensing Products, Optical Encoder Modules

Reliability Data

Description

Failure Rate Prediction

The following cumulative test results have been obtained

from testing performed at Avago Technologies in accord-

ance with the latest revision of MIL- STD-883.

The failure rate of semiconductor devices is determined

by the junction temperature of the device. The relation-

ship between ambient temperature and actual junction

temperature is given by the following:

Avago tests parts at the absolute maximum rated con-

ditions recommended for the device. The actual per-

formance you obtain from Avago parts depends on the

electrical and environmental characteristics of your ap-

plication but will probably be better than the perform-

ance outlined in Table ꢀ.

T_J(°C) = T_A(°C) + θ_JAP_AVG

where

T_A= ambient temperature in °C

_JA= thermal resistance of

junction-to-ambient in °C/watt

P_AVG= average power dissipated in watts

The estimated MTBF and failure rate at temperatures

lower than the actual stress temperature can be deter-

mined by using an Arrhenius model for temperature ac-

celeration. Results of such calculations are shown in the

table on the following page using an activation energy of

0.43 eV (reference MIL-HDBK-2ꢀ7).

Table 1. Life Tests

Demonstrated Performance

Point Typical Performance

Stress Test

Conditions

Total

Device Hrs.

Units

Tested

Total

Failed

Failure Rate

(% /1K Hours)

Test Name

MTBF

High Temperature

Operating Life

V_CC= 5.5 V,

V_A= V_B= 3.5 V

T_A= ꢀ00°C

ꢀ,405,000

ꢀ,405

702,500

0.ꢀ42

ꢀ000 hours

Temperature

Humidity

Operating Life

V_CC= 5.5 V

V_A= V_B= 3.5 V

ꢀ,000 hours

T_A= 85°C

ꢀ,495,000

ꢀ,495

ꢀ0

ꢀ49,500

0.669

RH = 85%

ꢀ

12 3 4

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