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HEDS-6500 PDF预览

HEDS-6500

更新时间: 2024-11-25 04:57:19
品牌 Logo 应用领域
安华高科 - AVAGO 光电编码器
页数 文件大小 规格书
4页 113K
描述
Motion Sensing Products, Optical Encoder Modules

HEDS-6500 数据手册

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HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series  
Motion Sensing Products, Optical Encoder Modules  
Reliability Data  
Description  
Failure Rate Prediction  
The following cumulative test results have been obtained  
from testing performed at Avago Technologies in accord-  
ance with the latest revision of MIL- STD-883.  
The failure rate of semiconductor devices is determined  
by the junction temperature of the device. The relation-  
ship between ambient temperature and actual junction  
temperature is given by the following:  
Avago tests parts at the absolute maximum rated con-  
ditions recommended for the device. The actual per-  
formance you obtain from Avago parts depends on the  
electrical and environmental characteristics of your ap-  
plication but will probably be better than the perform-  
ance outlined in Table ꢀ.  
TJ (°C) = TA (°C) + θJA PAVG  
where  
TA = ambient temperature in °C  
θ
JA = thermal resistance of  
junction-to-ambient in °C/watt  
PAVG = average power dissipated in watts  
The estimated MTBF and failure rate at temperatures  
lower than the actual stress temperature can be deter-  
mined by using an Arrhenius model for temperature ac-  
celeration. Results of such calculations are shown in the  
table on the following page using an activation energy of  
0.43 eV (reference MIL-HDBK-2ꢀ7).  
Table 1. Life Tests  
Demonstrated Performance  
Point Typical Performance  
Stress Test  
Conditions  
Total  
Device Hrs.  
Units  
Tested  
Total  
Failed  
Failure Rate  
(% /1K Hours)  
Test Name  
MTBF  
High Temperature  
Operating Life  
VCC = 5.5 V,  
VA = VB = 3.5 V  
TA = ꢀ00°C  
ꢀ,405,000  
ꢀ,405  
2
702,500  
0.ꢀ42  
ꢀ000 hours  
Temperature  
Humidity  
Operating Life  
VCC = 5.5 V  
VA = VB = 3.5 V  
ꢀ,000 hours  
TA = 85°C  
ꢀ,495,000  
ꢀ,495  
ꢀ0  
ꢀ49,500  
0.669  
RH = 85%  

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