Datasheet > HCM1012GH

HCM1012GH

更新时间： 2022-03-20 11:10:05

品牌	Logo	应用领域
优恩 - UNSEMI		/
页数	文件大小	规格书
6页	1317K
描述
HCM1012GH Series

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HCM1012GH 数据手册

(Chip Common Mode Filter Plus ESD function) Engineering Specification

HCM1012GH900BP

RECOMMENDED SOLDERING CONDITIONS

GENERAL TECHNICAL DATA

Opertation temperatur range : -40℃ ~ +85℃

Storage Condition : Less than 40℃ and 70% RH

Storage Time: 6 months Max.

Soldering method: Reflow or Wave Soldering

RELIABILITY AND TEST CONDITION

Test item

Test condition

A. Temperature : -40 ~ +85℃

B. Cycle : 100 cycles

Criteria

A. No mechanical damage

B. Impedance value should be

within ± 20 % of the initial value

C. Dwell time : 30minutes

Measurement : at ambient

temperature 24 hrs after test

completion

Temperature Cycle

A. Temperature : 85℃ ± 5℃

B. Test time : 1000 hrs

A. No mechanical damage

B. Impedance value should be

within ± 20 % of the initial value

C. Apply current : full rated current

Measurement : at ambient

temperature 24 hrs after test

completion

Operational Life

UN Semiconductor Co., Ltd.

www.unsemi.com.tw

@ UN Semiconductor Co., Ltd. 2014

Specifications are subject to change without notice.

Revision December 18, 2014

5 / 6

Please refer to www.unsemi.com.tw for current information.

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