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HCC4049UBDT PDF预览

HCC4049UBDT

更新时间: 2024-01-25 03:36:25
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 逻辑集成电路
页数 文件大小 规格书
15页 173K
描述
Rad-hard hex inverting buffer/converter

HCC4049UBDT 技术参数

生命周期:Active包装说明:DIP,
Reach Compliance Code:compliant风险等级:5.72
其他特性:CMOS-TTL LEVEL TRANSLATOR系列:4000/14000/40000
JESD-30 代码:R-CDIP-T16长度:20.32 mm
逻辑集成电路类型:INVERTER功能数量:6
输入次数:1端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
座面最大高度:3.83 mm最大供电电压 (Vsup):20 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
总剂量:100k Rad(Si) V宽度:7.62 mm
Base Number Matches:1

HCC4049UBDT 数据手册

 浏览型号HCC4049UBDT的Datasheet PDF文件第2页浏览型号HCC4049UBDT的Datasheet PDF文件第3页浏览型号HCC4049UBDT的Datasheet PDF文件第4页浏览型号HCC4049UBDT的Datasheet PDF文件第5页浏览型号HCC4049UBDT的Datasheet PDF文件第6页浏览型号HCC4049UBDT的Datasheet PDF文件第7页 
6
Order codes  
Table 13. Ordering information  
ESCC detailed  
specification  
Order code  
Quality level  
Radiation level  
Package  
Flat-14  
DIL-14  
Flat-14  
DIL-14  
Flat-16  
DIL-16  
Flat-14  
DIL-14  
Flat-14  
DIL-14  
Lead finish  
M
HCC4001BKG  
HCC4001BKT  
HCC4001BDG  
HCC4001BDT  
HCC4002BKG  
HCC4002BKT  
HCC4002BDG  
HCC4002BDT  
HCC4008BKG  
HCC4008BKT  
HCC4008BDG  
HCC4008BDT  
HCC4011BKG  
HCC4011BKT  
HCC4011BDG  
HCC4011BDT  
HCC4012BKG  
HCC4012BKT  
HCC4012BDG  
HCC4012BDT  
9201/041/01  
9201/041/02  
9201/041/03  
9201/041/04  
9201/042/01  
9201/042/02  
9201/042/03  
9201/042/04  
9202/039/01  
9202/039/02  
9202/039/08  
9202/039/09  
9201/043/01  
9201/043/02  
9201/043/03  
9201/043/04  
9201/044/01  
9201/044/02  
9201/044/03  
9201/044/04  
Gold  
Solder dip  
Gold  
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
ESCC flight  
100 krad  
Solder dip  
Gold  
Solder dip  
Gold  
ESCC flight  
ESCC flight  
ESCC flight  
ESCC flight  
100 krad  
100 krad  
100 krad  
100 krad  
Solder dip  
Gold  
Solder dip  
Gold  
Solder dip  
Gold  
Solder dip  
Gold  
Solder dip  
Gold  
Solder dip  
Gold  
Solder dip  

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