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HC55185DIMZ96 PDF预览

HC55185DIMZ96

更新时间: 2024-01-21 02:34:14
品牌 Logo 应用领域
瑞萨 - RENESAS 电池电信电信集成电路
页数 文件大小 规格书
20页 1007K
描述
VoIP Ringing SLIC; PLCC28; Temp Range: See Datasheet

HC55185DIMZ96 技术参数

生命周期:Unknown零件包装代码:PLCC
包装说明:QCCJ, LDCC28,.5SQ针数:28
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5电池馈电:CONSTANT CURRENT
混合:2-4 CONVERSIONJESD-30 代码:S-PQCC-J28
JESD-609代码:e3长度:11.505 mm
湿度敏感等级:3最大噪声:13 dBrnC
功能数量:1端子数量:28
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:QCCJ
封装等效代码:LDCC28,.5SQ封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):245
电源:5 V认证状态:Not Qualified
座面最大高度:4.57 mm子类别:Analog Transmission Interfaces
最大压摆率:0.0135 mA标称供电电压:5 V
表面贴装:YES技术:BIPOLAR
电信集成电路类型:SLIC温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:11.505 mm
Base Number Matches:1

HC55185DIMZ96 数据手册

 浏览型号HC55185DIMZ96的Datasheet PDF文件第2页浏览型号HC55185DIMZ96的Datasheet PDF文件第3页浏览型号HC55185DIMZ96的Datasheet PDF文件第4页浏览型号HC55185DIMZ96的Datasheet PDF文件第5页浏览型号HC55185DIMZ96的Datasheet PDF文件第6页浏览型号HC55185DIMZ96的Datasheet PDF文件第7页 
DATASHEET  
HC55185  
VoIP Ringing SLIC Family  
FN4831  
Rev 15.00  
February 9, 2012  
The RSLIC-VoIP family of  
ringing subscriber line  
interface circuits (RSLIC)  
supports analog Plain Old  
Telephone Service (POTS) in  
Features  
• Onboard Ringing Generation  
• Compatible with Existing HC5518x Devices  
• Low Standby Power Consumption (75V, 65mW)  
• Reduced Idle Channel Noise  
short and medium loop length, wireless and wireline  
applications. Ideally suited for remote subscriber units, this  
family of products offers flexibility to designers with high  
ringing voltage and low power consumption system  
requirements.  
• Programmable Transient Current Limit  
• Improved Off Hook Software Interface  
• Integrated MTU DC Characteristics  
• Low External Component Count  
The RSLIC-VoIP family operates to 100V, which translates  
directly to the amount of ringing voltage supplied to the end  
subscriber. With the high operating voltage, subscriber loop  
lengths can be extended to 500(i.e., 5,000 feet) and  
beyond.  
• Silent Polarity Reversal  
• Pulse Metering and On Hook Transmission  
• Tip Open Ground Start Operation  
• Balanced and Unbalanced Ringing  
• Thermal Shutdown with Alarm Indicator  
• 28 Lead Surface Mount Packaging  
• Reduced Footprint Micro Leadframe Packaging  
• Dielectric Isolated (DI) High Voltage Design  
• QFN Package Option  
Other key features across the product family include: low  
power consumption, ringing using sinusoidal or trapezoidal  
waveforms, robust auto-detection mechanisms for when  
subscribers go on or off hook, and minimal external discrete  
application components. Integrated test access features are  
also offered on selected products to support loopback  
testing as well as line measurement tests.  
There are five product offerings of the HC55185 with each  
version providing voltage grades of high battery voltage and  
longitudinal balance. The voltage feed amplifier design uses  
low fixed loop gains to achieve high analog performance  
with low susceptibility to system induced noise.  
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat  
No Leads - Product Outline  
- Near Chip Scale Package Footprint; Improves PCB  
Efficiency and has a Thinner Profile  
Block Diagram  
• Pb-free (RoHS compliant)  
POL  
CDC  
VBL  
VBH  
Applications  
• Voice Over Internet Protocol (VoIP)  
• Cable Modems  
ILIM  
DC  
CONTROL  
BATTERY  
SWITCH  
RINGING  
PORT  
VRS  
• Voice Over DSL (VoDSL)  
• Short Loop Access Platforms  
• Remote Subscriber Units  
Terminal Adapters  
2-WIRE  
PORT  
TIP  
VRX  
VTX  
-IN  
RING  
TRANSMIT  
SENSING  
4-WIRE  
PORT  
TRANSIENT  
CURRENT  
LIMIT  
VFB  
TL  
Related Literature  
AN9814, “HC5518XEVAL Evaluation Board User’s Guide”  
F2  
F1  
F0  
SW+  
SW-  
TEST  
ACCESS  
DETECTOR  
LOGIC  
CONTROL  
LOGIC  
AN9824, “SPICE Model Tutorial of the RSLIC18™ AC  
Loop”  
RTD RD E0 DETALM  
BSEL SWC  
• Interfacing to DSP CODECs (Contact Factory)  
TB379 “Thermal Characterization of Packaged  
Semiconductor Devices”  
AN9922, “Thermal Characterization and Board Level  
Modeling of the RSLIC18 in the MLFP Package”  
FN4831 Rev 15.00  
February 9, 2012  
Page 1 of 20  

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