HC-5509B3999-003
Functional Diagram
SOIC
R
-IN 1
VRX
17
OUT 1
12
VFB
24
VTX
19
DG
AG
VB+
13
2
22
1
R
28
27
25
-
BG
TF
TF
2R
-
+
+
OP AMP
BIAS
NETWORK
R/2
2R
2R
VB-
RF
1
4
5
R
R
R
F1
F0
RS
-
SHD
TA
SW
14
6
TIP
+
R
2R
THERM
LTD
TSD
9
TST
PRI
4.5k
20
21
23
7
25k
100k
100k
100k
100k
RTD
GKD
15
GK
PR
RING
RFS
-
90k
LA
+
RD
25k
16
FAULT
DET
SHD
GKD
ALM
4.5k
8
90k
90k
RFC
10
-
26
90k
-
RF
RF
RF
11
2
VB/2
REF
+
GM
+
R = 108kΩ
18
3
C
C
2
I
1
LMT
Die Characteristics
Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .174 x 120
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Connected
Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI
TABLE 1.
TEST
PERFOR-
PARAMETER
CONDITION MANCE (MAX) UNITS
Longitudinal Surge
10µs Rise/
1000µs Fall
±1000 (Plastic)
±1000 (Plastic)
±1000 (Plastic)
700 (Plastic)
V
V
V
PEAK
PEAK
PEAK
Overvoltage Protection and Longitudinal
Current Protection
Metallic Surge
10µs Rise/
1000µs Fall
T/GND
R/GND
10µs Rise/
1000µs Fall
The SLIC device, in conjunction with an external protection
bridge, will withstand high voltage lightning surges and
power line crosses.
50/60Hz Current
T/GND
11 Cycles
Limited to
V
RMS
R/GND
10A
High voltage surge conditions are as specified in Table 1.
The SLIC will withstand longitudinal currents up to a
RMS
maximum or 30mA
, 15mA per leg, without any
RMS
RMS
performance degradation.
7