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HA17558PS-E PDF预览

HA17558PS-E

更新时间: 2024-02-06 03:37:49
品牌 Logo 应用领域
瑞萨 - RENESAS 运算放大器光电二极管
页数 文件大小 规格书
13页 145K
描述
DUAL OP-AMP, 6000uV OFFSET-MAX, PDIP8, 6.30 X 9.60 MM, 2.54 MM PITCH, PLASTIC, DIP-8

HA17558PS-E 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.52
放大器类型:OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB):0.5 µA
标称共模抑制比:100 dB最大输入失调电压:6000 µV
JESD-30 代码:R-PDIP-T8长度:9.6 mm
负供电电压上限:-18 V标称负供电电压 (Vsup):-15 V
功能数量:2端子数量:8
最高工作温度:75 °C最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
认证状态:Not Qualified座面最大高度:5.06 mm
标称压摆率:1 V/us子类别:Operational Amplifier
供电电压上限:18 V标称供电电压 (Vsup):15 V
表面贴装:NO技术:BIPOLAR
温度等级:COMMERCIAL EXTENDED端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
宽度:7.62 mmBase Number Matches:1

HA17558PS-E 数据手册

 浏览型号HA17558PS-E的Datasheet PDF文件第7页浏览型号HA17558PS-E的Datasheet PDF文件第8页浏览型号HA17558PS-E的Datasheet PDF文件第9页浏览型号HA17558PS-E的Datasheet PDF文件第10页浏览型号HA17558PS-E的Datasheet PDF文件第11页浏览型号HA17558PS-E的Datasheet PDF文件第12页 
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,  
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to  
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
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is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a  
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cannot be imported into a country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.  
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Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
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© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.  
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