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GRM188R11H562MA01# PDF预览

GRM188R11H562MA01#

更新时间: 2023-09-03 20:40:16
品牌 Logo 应用领域
村田 - MURATA 医疗医疗器械
页数 文件大小 规格书
30页 849K
描述
民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备]

GRM188R11H562MA01# 数据手册

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Specification  
Test Method  
(Ref. Standard:JIS C 5101, IEC60384)  
No  
Item  
Temperature  
High Dielectric  
Constant Type  
Compensating Type  
10 Vibration  
Appearance No defects or abnormalities.  
Capacitance Within the specified initial value.  
Q or D.F. Within the specified initial value.  
Solder the capacitor on the test substrate shown in Fig.3.  
Kind of Vibration  
Total amplitude  
:
A simple harmonic motion  
10Hz to 55Hz to 10Hz (1min)  
: 1.5mm  
This motion should be applied for a period of 2h in each 3 mutually  
perpendicular directions(total of 6h).  
11 Substrate  
Bending test  
Appearance No defects or abnormalities.  
Capacitance Within +/-5% or +/-0.5pF  
Solder the capacitor on the test substrate shown in Fig.1.  
Pressurization method : Shown in Fig.2  
Within +/-10%  
Change  
(Whichever is larger)  
Flexureꢀ  
ꢀꢀꢀ: 1mm  
Holding Time  
Soldering Method  
:
5+/-1s  
:
Reflow soldering  
12 Solderability  
Test Method  
Flux  
:
Solder bath method  
Solution of rojin ethanol 25(wt)%  
80to 120for 10s to 30s  
Sn-3.0Ag-0.5Cu  
95% of the terminations is to be soldered evenly and continuously.  
Preheat  
:
:
Solder  
Solder Temp.  
Immersion time  
: 245+/-5℃  
: 2+/-0.5s  
13 Resistance to  
Appearance No defects or abnormalities.  
<GRM03 size min.>  
Test Method  
Solder  
Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Within +/-7.5%  
:
Solder bath method  
Sn-3.0Ag-0.5Cu  
270+/-5℃  
Change  
Q or D.F.  
I.R.  
(Whichever is larger)  
:
:
Solder Temp.  
Immersion time  
Exposure Time  
Preheat  
Within the specified initial value.  
Within the specified initial value.  
: 10+/-0.5s  
:
24+/-2h  
:
GRM31 size max.: 120to 150for 1 min  
GRM32 size ꢀꢀ : 100to 120for 1 min  
and 170to 200for 1 min  
Voltage proof No defects.  
· Initial measurement for high dielectric constant type  
Perform a heat treatment at 150+0/-10°C for 1h and then  
let sit for 24+/-2h at room temperature, then measure.  
<GRM02 size only>  
Test Method  
Solder  
:
Reflow soldering (hot plate)  
Sn-3.0Ag-0.5Cu  
: 270+/-5℃  
:
Solder Temp.  
Reflow Time  
Test Substrate  
Exposure Time  
Preheat  
:
10+/-0.5s  
:
Glass epoxy PCB  
24+/-2h  
:
:
120to 150for 1 min  
· Initial measurement for high dielectric constant type  
Perform a heat treatment at 150+0/-10°C for 1h and then  
let sit for 24+/-2h at room temperature, then measure.  
14  
Appearance No defects or abnormalities.  
Solder the capacitor on the test substrate shown in Fig.3.  
Temperature  
Capacitance Within +/-2.5% or+/- 0.25pF Within +/-7.5%  
Sudden Change  
Change  
Q or D.F.  
I.R.  
(Whichever is larger)  
Perform the five cycles according to the four heat treatments  
shown in the following table.  
Within the specified initial value.  
Within the specified initial value.  
Step  
Temp.(C)  
Min.Operating Temp.+0/-3  
Room Temp.  
Time (min)  
30+/-3  
2 to 3  
1
2
3
4
Voltage proof No defects.  
30+/-3  
2 to 3  
Max.Operating Temp.+3/-0  
Room Temp  
Exposure Time  
: 24+/-2h  
· Initial measurement for high dielectric constant type  
Perform a heat treatment at 150+0/-10°C for 1h and then  
let sit for 24+/-2h at room temperature, then measure.  
JEMCGS-0001U  
3

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