Datasheet > GRM1881X1H241JA01#

GRM1881X1H241JA01#

更新时间： 2023-09-03 20:39:40

品牌	Logo	应用领域
村田 - MURATA		医疗医疗器械
页数	文件大小	规格书
31页	1860K
描述
民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备]

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Table A Capacitance Change between at Reference Temp. and at each Temp. (%)

-55℃

-25℃

-10℃

Char.

Max.

Min.

Max.

Min.

Max.

Min.

Substrate Bending test

Except for Substrate Bending test

・Test substrate

Material

Thickness

・Test substrate

Material

Thickness

JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

1.6mm

JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

1.6mm or 0.8mm

Copper Foil Thickness 0.035mm

Kind of Solder

Sn-3.0Ag-0.5Cu(Lead Free Solder)

Kind of Solder

Sn-3.0Ag-0.5Cu(Lead Free Solder)

・Land Dimension

Dimension(mm)

Type

GRM18

1.0

3.0

1.2

GRM18

1.0

3.0

1.2

・Pressurization Method

GRM1881X1H241JA01-01A

1 2 3 456 7 8...31

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