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C02E.pdf
05.12.14
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GNM Series Specifications and Test Methods (2)
Continued from the preceding page.
Specifications
No.
Item
Test Method
No cracking or marking defects shal occur.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 2 using a eutectic solder. Then apply a force in the
direction shown in Fig. 3. The soldering should be done either
with an iron or using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
20
Pressurizing
50
speed : 1.0mm/sec.
Pressurize
R230
Thickness : 0.8mm
12 Deflection
100
5.0
Flexure : V1
a
b
Capacitance meter
45 45
c
1.0
d
Fig. 3
Type
a
b
c
d
2.0T0.5 0.5T0.05 0.32T0.050.32T0.05
2.0T0.05 0.6T0.05 0.5T0.05 0.5T0.05
GNM1M2
GNM212
(in mm)
Fig. 2
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
80 to 120°C for 10 to 30 seconds. After preheating, immerse in
eutectic solder solution for 2T0.5 seconds at 230T5°C or
Sn-3.0Ag-0.5Cu solder solution for 2T0.5 seconds at 245T5°C.
Solderability of
Termination
75% of the terminations are to be soldered evenly
and continuously.
13
10
Appearance
No marking defects
Preheat the capacitor at 120 to 150°C for 1 minute. Immerse
the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu solder
solution at 270T5°C for 10T0.5 seconds.
Let sit at room temperature for 24T2 hours, then measure.
• Initial measurement
Perform a heat treatment at 150 +0/-10°C for one hour and
then let sit for 24T2 hours at room temperature. Perform
the initial measurement.
Capacitance
Change
R6: Within T7.5%
Resistance
14 to Soldering D.F.
0.1 max.
Heat
I.R.
50Ω · F min.
Dielectric
Strength
No failure
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10).
Perform the five cycles according to the four heat treatments
listed in the following table.
Appearance
No marking defects
R6: Within T12.5%
Capacitance
Change
D.F.
I.R.
0.1 max.
Let sit for 24T2 hours at room temperature, then measure.
Step
1
2
3
4
50Ω · F min.
Temperature
Cycle
Min. Operating Room Max. Operating Room
15
Temp. (D)
Temp.
Temp.
Temp.
Temp.
30T3
30T3
Time (min.)
2 to 3
2 to 3
Dielectric
Strength
No failure
• Initial measurement
Perform a heat treatment at 150 +0/-10 °C for one hour and
then let sit for 24T2 hours at room temperature.
Perform the initial measurement.
Appearance
No marking defects
Apply the rated voltage at 40T2°C and 90 to 95% humidity for
500T12 hours. The charge/discharge currentis less than 50mA.
• Initial measurement
Perform a heat treatment at 150 +0/-10°C for one hour
and then let sit for 24T2 hours at room temperature.
Perform the initial measurement.
Capacitance
Change
R6: Within T12.5%
High
Temperature
High
D.F.
I.R.
0.2 max.
16
Humidity
(Steady)
12.5Ω · F min.
• Measurement after test
Perform a heat treatment at 150 +0/-10°C for one hour
and then let sit for 24T2 hours at room temperature, then
measure.
Dielectric
Strength
No failure
Appearance
No marking defects
Apply 125% of the rated voltage for 1000T12 hours at the
maximum operating temperature T3°C. Let sit for 24T2 hours
at room temperature, then measure.
The charge/discharge current is less than 50mA.
• Initial measurement
Perform a heat treatment at 150 +0/-10°C for one hour
and then let sit for 24T2 hours at room temperature.
Perform the initial measurement.
Capacitance
Change
R6: Within T12.5%
D.F.
I.R.
0.2 max.
25Ω · F min.
17 Durability
• Measurement after test
Dielectric
Strength
No failure
Perform a heat treatment at 150 +0/-10°C for one hour
and then let sit for 24T2 hours at room temperature, then
measure.
60