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GMS30C2132 PDF预览

GMS30C2132

更新时间: 2024-02-06 00:22:08
品牌 Logo 应用领域
海力士 - HYNIX /
页数 文件大小 规格书
322页 1223K
描述
USERS MANUAL

GMS30C2132 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:QFP,针数:160
Reach Compliance Code:unknown风险等级:5.84
地址总线宽度:26桶式移位器:YES
边界扫描:NO外部数据总线宽度:32
格式:FLOATING POINT内部总线架构:SINGLE
JESD-30 代码:S-PQFP-G160长度:28 mm
低功率模式:YES端子数量:160
最高工作温度:85 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装形状:SQUARE封装形式:FLATPACK
认证状态:Not Qualified座面最大高度:4.07 mm
最大供电电压:3.6 V最小供电电压:3.3 V
标称供电电压:3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:28 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHERBase Number Matches:1

GMS30C2132 数据手册

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Revision 3.1  
Published by  
IDA Team in Hynix Semiconductor Inc.  
¨ Ï Hynix Semiconductor 2001. All Right Reserved.  
Hynix Offices in Korea or Distributors and Representatives listed at address directory may serve  
additional information of this manual.  
Hynix reserves the right to make changes to any Information here in at any time without notice.  
The information, diagrams, and other data in this manual are correct and reliable; however, Hynix is  
in no way responsible for any violations of patents or other rights of the third party generated by the  
use of this manual.  

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