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GM71CS17403CLJ-7 PDF预览

GM71CS17403CLJ-7

更新时间: 2024-01-25 12:42:08
品牌 Logo 应用领域
其他 - ETC 动态存储器
页数 文件大小 规格书
10页 100K
描述
x4 EDO Page Mode DRAM

GM71CS17403CLJ-7 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOJ包装说明:SOJ, SOJ24/26,.34
针数:24Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.92访问模式:FAST PAGE WITH EDO
最长访问时间:70 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/BATTERY BACKUP/SELF REFRESH
I/O 类型:COMMONJESD-30 代码:R-PDSO-J24
JESD-609代码:e0长度:16.9 mm
内存密度:16777216 bit内存集成电路类型:EDO DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:24
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装等效代码:SOJ24/26,.34
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified刷新周期:2048
座面最大高度:3.75 mm自我刷新:YES
最大待机电流:0.00015 A子类别:DRAMs
最大压摆率:0.1 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:J BEND端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

GM71CS17403CLJ-7 数据手册

 浏览型号GM71CS17403CLJ-7的Datasheet PDF文件第4页浏览型号GM71CS17403CLJ-7的Datasheet PDF文件第5页浏览型号GM71CS17403CLJ-7的Datasheet PDF文件第6页浏览型号GM71CS17403CLJ-7的Datasheet PDF文件第7页浏览型号GM71CS17403CLJ-7的Datasheet PDF文件第8页浏览型号GM71CS17403CLJ-7的Datasheet PDF文件第10页 
GM71C(S)17403C/CL  
18.  
19.  
In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying  
data to the device. After RAS is reset, if tOEH>=tCWL, the I/O pin will remain open circuit (high  
impedance); if tOEH<=tCWL, invalid data will be out at each I/O.  
The 16M DRAM offers a 16-bit time saving parallel test mode. Address CA0 and CA1 for the  
4M x 4 are don't care during test mode. Test mode is set by performing a WE-and-CAS-before-  
RAS (WCBR) cycle. In 16-bit parallel test mode, data is written into 4 bits in parallel at each I/O  
(I/O1 to I/O4) and read out from each I/O. If 4 bits of each I/O are equal (all 1s or 0s), data  
output pin is high state during test mode read cycle, then the device has passed. If they are not  
equal, data output pin is a low state, then the device has failed. Refresh during test mode  
operation can be performed by normal read cycles or by WCBR refresh cycles. To get out of test  
mode and enter a normal operation mode, perform either a regular CAS-before-RAS refresh  
cycle or RAS-only refresh cycle.  
20.  
In a test mode read cycle, the value of tRAC, tAA, tCAC and tACP is delayed by 2ns to 5ns for the  
specified value. These parameters should be specified in test mode cycles by adding the above  
value to the specified value in this data sheet.  
21.  
22.  
23.  
24.  
tRAS(min) = tRWD(min) + tRWL(min) + tT in Read - Modify - Write cycle.  
tCAS(min) = tCWD(min) + tCWL(min) + tT in Read - Modify - Write cycle.  
tOFF and tOFR are determined by the later rising edge of RAS or CAS.  
tCSH(min) can be achieved when tRCD <= tCSH(min) - tCAS(min).  
Rev 0.1 / Apr’01  

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