Datasheet > FX-424-DAF-A3M5

FX-424-DAF-A3M5

更新时间： 2023-02-26 14:09:21

品牌	Logo	应用领域
美高森美 - MICROSEMI		ATM 异步传输模式光电二极管
页数	文件大小	规格书
8页	493K
描述
ATM/SONET/SDH Support Circuit, 1-Func, PDSO13, PACKAGE-14/13

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数据手册

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FX-424-DAF-A3M5 数据手册

Reﬂow Proﬁle

Table 5. Reﬂow Proﬁle (IPC/JEDEC J-STD-020C)

Parameter

Symbol

t_S

Value

PreHeat Time

Ramp Up

60 sec Min, 180 sec Max

R_UP

t_L

3 ꢀC/sec Max

60 sec Min, 150 sec Max

480 sec Max

Time Above 217 ꢀC

Time To Peak Temperature

t_AMB-P

Time At 260 ꢀC

Ramp Down

t_P

20 sec Min, 40 sec Max

6 ꢀC/sec Max

R_DN

The FX-424 is qualiﬁed to meet the JEDEC stan-

dard for Pb-Free assembly. The temperatures

and time intervals listed are based on the Pb-Free

small body requirements. The temperatures refer

to the topside of the package, measured on the

package body surface. The FX-427 should not

be subjected to a wash process that will immerse

it in solvents. NO CLEAN is the recommended

procedure. The FX-427 has been designed for pick

and place reﬂow soldering. The FX-427 may be

reﬂowed once and should not be reﬂowed in the

inverted position.

Figure 4. Suggested IR Proﬁle

Tape and Reel

Table 6. Tape and Reel Information

Reel Dimensions (mm)

Tape Dimensions (mm)

1.5

#/Reel

200

20.2

330

1.5

20.2

100

44.4

50.4

Figure 5. Tape and Reel

Page 4 of 8

Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com

1 2 345 6 7 8

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