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FTW1608FE6R8MT PDF预览

FTW1608FE6R8MT

更新时间： 2024-03-03 10:09:23
品牌 Logo 应用领域
长江微电 - CJIANG /
页数 文件大小 规格书
10页 1991K
描述
铁氧体绕线

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中文翻译

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FTW1608FE6R8MT 数据手册

 浏览型号FTW1608FE6R8MT的Datasheet PDF文件第4页浏览型号FTW1608FE6R8MT的Datasheet PDF文件第5页浏览型号FTW1608FE6R8MT的Datasheet PDF文件第6页浏览型号FTW1608FE6R8MT的Datasheet PDF文件第7页浏览型号FTW1608FE6R8MT的Datasheet PDF文件第9页浏览型号FTW1608FE6R8MT的Datasheet PDF文件第10页 
c. When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to  
give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of  
electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices.  
8.3 Recommended PCB Design for SMT Land-Patterns  
When chips are mounted on a PCB, the amount of solder used (size of fillet) and the size of PCB Land-Patterns can directly affect chip  
performance (such as Q). And they can also cause other soldering question (such as offset and side lap). Therefore, the following items  
must be carefully considered in the design of solder land patterns.  
a. Please use the PCB pad and solder paste we recommend, and contact us in advance if they need to be changed.  
b. Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage  
the insulation film of wires, then causing short circuit of parts.  
c. The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking.  
Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in  
turn determines the amount of solder necessary to form the fillets.  
d. When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering  
point is separated by solder-resist.  
Recommended land dimensions please refer to product specification.  
9. Recommended Soldering Technologies  
This product is only for reflow soldering and iron soldering.  
9.1 Re-flowing Profile  
Peak 260℃max  
260℃  
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Preheat condition: 150~200℃/60~120sec.  
Allowed time above 217C: 60~90sec.  
Max temp: 260℃  
Max Ramp Up Rate=3℃/sec.  
217℃  
Max Ramp Down Rate =6℃/sec.  
Max time at max temp: 10sec.  
Solder paste: Sn/3.0Ag/0.5Cu  
Allowed Reflow time: 2 times max.  
60～90sec.  
200℃  
150℃  
60～120sec.  
25℃  
Time 25℃ to Peak= 8 min Max  
[Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board  
assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters  
as the Reflow profile shows.]  
9.2 Iron Soldering Profile  
3sec. Max.  
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Iron soldering power: 30W Max.  
Preheat condition: 150℃/60sec.  
Soldering tip temperature: 350℃ Max.  
Soldering time: 3sec. Max.  
350℃  
Soldering Iron Power：  
Max.30W  
Solder paste: Sn/3.0Ag/0.5Cu  
Iron Soldering time: 1 time max.  
Diameter of Soldering：  
Iron 1.0mm max.  
Tc ℃  
[Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]  
9.3 Maintenance of heat gun (for your reference)  
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Power output: 30W  
Temperature: 350℃ Max  
Heat time: More than 5 seconds heating may cause short circuit of parts.  
10. Solder Volume  
Solder shall be used not to exceed as shown below.  
Specifications subject to change without notice. Please check our website for latest informations.  
WWW.CJIANG.TW  
1...5678910

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