Datasheet > FMS2029_1

FMS2029_1

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
FILTRONIC		开关
页数	文件大小	规格书
5页	201K
描述
DC-20 GHZ MMIC SPST ABSORPTIVE SWITCH

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FMS2029_1 数据手册

FMS2029

Pre-Production Datasheet v3.0

PREFERRED ASSEMBLY INSTRUCTIONS:

HANDLING PRECAUTIONS:

To avoid damage to

GaAs devices are fragile and should be

handled with great care. Specially designed

collets should be used where possible.

the

devices

care

should be exercised

during

Proper

handling.

Electrostatic

The back of the die is metallised and the

recommended mounting method is by the use

of conductive epoxy. Epoxy should be applied

to the attachment surface uniformly and

sparingly to avoid encroachment of epoxy on

to the top face of the die and ideally should not

exceed half the chip height. For automated

dispense Ablestick LMISR4 is recommended

and for manual dispense Ablestick 84-1 LMI or

84-1 LMIT are recommended. These should be

cured at a temperature of 150°C for one hour

in an oven especially set aside for epoxy

curing only. If possible the curing oven should

be flushed with dry nitrogen. Eutectic die

attach is not recommended.

Discharge

(ESD)

precautions should be observed at all stages

of storage, handling, assembly, and testing.

These devices should be treated as Class 1A

(250-500 V) as defined in JEDEC Standard

No. 22-A114. Further information on ESD

control measures can be found in MIL-STD-

1686 and MIL-HDBK-263.

APPLICATION NOTES & DESIGN DATA:

Application Notes and design data including S-

parameters are available on request.

This part has gold (Au) bond pads requiring

the use of gold (99.99% pure) bondwire. It is

recommended that 25.4µm diameter gold wire

be used. Thermosonic ball bonding is

preferred. A nominal stage temperature of

150°C and a bonding force of 40g has been

shown to give effective results for 25µm wire.

Ultrasonic energy shall be kept to a minimum.

For this bonding technique, stage temperature

should not be raised above 200°C and bond

force should not be raised above 60g.

DISCLAIMERS:

This product is not designed for use in any

space based or life sustaining/supporting

equipment.

ORDERING INFORMATION:

PART NUMBER

DESCRIPTION

Thermosonic

wedge

bonding

and

thermocompression wedge bonding can also

be used to achieve good wire bonds.

FMS2029-000-WP

Die in Waffle-pack

(Gel-pak available on

request)

Bonds should be made from the die first and

then to the mounting substrate or package.

The physical length of the bondwires should be

minimised especially when making RF or

ground connections.

Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

Fax: +44 (0) 1325 306177

Email: sales@filcs.com

Website: www.filtronic.com

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