Advanced Product Information 1.1
FMS2022
Truth Table:
Control Lines
RF Path
A2 B2 A3 B3 A4 B4 IN-OUT1 IN-OUT2 IN-OUT3 IN-OUT4
A1 B1
-5V
0V
0V
0V
0V
0V -5V 0V -5V 0V -5V
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
ON
-5V -5V 0V
0V -5V 0V -5V
0V -5V
OFF
OFF
OFF
-5V
-5V
0V -5V -5V 0V
OFF
OFF
0V -5V 0V -5V -5V 0V
OFF
Note: -5V ± 0.5V, 0V+0.5V
Pad Layout:
OUT1
GND1 OUT2
Pad
Reference
Description
Pin Coordinates
(µm)
A2
IN
OUT1
OUT2
OUT3
OUT4
A1
RFIN
RFOUT1
RFOUT2
RFOUT3
RFOUT4
A1
142,657.5
142,1174
675,1174
675,141
142,141
805,878
805,731
805,1172
805,1025
805,290
805,143
805,584
805,437
504,1174
504,141
142,869
142,446
B2
A1
GND3
B1
A4
IN
B1
B1
A2
A2
GND4
B4
A3
B2
B2
A3
A3
B3
B3
B3
A4
A4
B4
B4
OUT4
GND2 OUT3
GND1
GND2
GND3
GND4
GND
GND
GND
GND
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size
( µm x µm )
Min. Bond Pad
Min. Bond pad
Die Thickness (µm)
Pitch(µm)
Opening (µm xµm )
950 x 1320
150
130
94 x 94
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790
Fax: +1 (408) 850 5766
Email: sales@filcsi.com
Website: www.filtronic.co.uk/semis