Datasheet > FMS2018

FMS2018

更新时间： 2024-02-15 16:36:07

品牌	Logo	应用领域
FILTRONIC		开关 GSM
页数	文件大小	规格书
5页	332K
描述
SP7T GaAs Multi-Band GSM ? UMTS Antenna Switch

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技术参数
数据手册

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FMS2018 技术参数

生命周期：	Obsolete	Reach Compliance Code：	unknown
风险等级：	5.84	Base Number Matches：	1

FMS2018 数据手册

Advanced Product Information ^1.2

FMS2018

Truth Table:

VTx1

VTx2

VTx3

VRx1

VRx2

VRx3

VRx4

ON PATH

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

ANT-TX1

ANT-TX2

ANT-TX3

ANT-RX1

ANT-RX2

ANT-RX3

ANT-RX4

Note: ‘High’ = +2.5V to +5V

‘Low’ = 0V to +0.2V

Pad

Name

Description

Coordinates

Pad and Die Layout:

(µm)

ANT

Tx1

Antenna

698, 1167

TX1 RF Output

TX2 RF Output

TX3 RF Output

RX1 RF Output

RX2 RF Output

RX3 RF Output

RX4 RF Output

183, 110

Tx2

182, 498

Tx3

184, 1147

1066, 536

1063, 663

1063, 993

1066, 1126

693, 102

Rx1

Rx2

Rx3

Rx4

VTX1

VTX2

VTX3

VRX1

V RX2

V RX3

V RX4

VRXC

TX1 Control Voltage

TX2 Control Voltage

TX3 Control Voltage

RX1 Control Voltage

RX2 Control Voltage

RX3 Control Voltage

RX4 Control Voltage

798, 102

903, 102

995, 633

1066, 326

1066, 427

1008, 102

1113, 102

Common Receive Switch

Control Voltage

GND T1

GND T2

GND T3

GND Rc

Ground 1

Ground 2

Ground 3

Ground 4

178, 392

184, 764

184, 877

1066, 771

Note: Co-ordinates are referenced from the

bottom left hand corner of the die to the centre

of the bond pad opening

Min. Bond Pad

Min. Bond pad

Die Size (µm)

Die Thickness (µm)

Pitch(µm)

opening (µm)

1230 x 1250

100

70 x 70

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Email: sales@filss.com

Website: www.filcs.com

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