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FH30M-80S-0.4SHW PDF预览

FH30M-80S-0.4SHW

更新时间： 2024-02-05 22:12:08
品牌 Logo 应用领域
广濑 - HRS /
页数 文件大小 规格书
8页 634K
描述
0.3 or 0.4 mm pitch, 3 mm above the board, Flip-Lock actuator, Flexible Printed Circuit ZIF connectors

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FH30M-80S-0.4SHW 数据手册

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FH30 Series●0.3 or 0.4mm pitch, 3mm above the board, Flip-Lock actuator, Flexible Printed Circuit ZIF connectors  
■
Recommended PCB mounting ■Recommended FPC Dimensions  
pattern and metal mask dimensions  
0.3+0.04  
-0.03  
0.1 0.05  
0.07 0.07  
No(n-1)  
B
0.05  
A
No.1  
Q
0.05  
C
0.05  
0.3 0.03(Land)  
R
0.05  
0.25 0.03(Metal mask)  
No.2  
No (n)  
0.3 0.05  
Q
R
0.02  
0.02  
2
0.3+0.04  
-0.03  
Detail A  
0.3 0.07  
B
F
0.03  
0.05  
0.1  
0.3 0.07  
R
0.05  
0.3 0.03(Land)  
Mark side  
0.25 0.03(Metal mask)  
G
D
0.05  
H
J
MIN  
Recommended metal mask thickness: t=0.15  
0.1  
Note 1  
:
Conductor width shall be 0.1 0.05 if FPC has plating bars.  
All dimensions: mm  
Part Number  
CL No.  
Number of Contacts FPC contact pitch  
B
C
D
F
G
H
J
Q
R
FH30-60S-0.3SHW(05) 580-0105-8-05  
FH30-80S-0.3SHW(05) 580-0100-4-05  
FH30-90S-0.3SHW(05) 580-0106-0-05  
FH30M-80S-0.4SHW(05) 580-0102-0-05  
FH30M-96S-0.4SHW(05) 580-0103-2-05  
60  
80  
90  
80  
96  
0.3  
0.3  
0.3  
0.4  
0.4  
17.7 17.4 17.4 18.3 18.8 19.3 20.3 0.3 0.6  
23.7 23.4 23.4 24.3 24.8 25.3 26.3 0.3 0.6  
26.7 26.4 26.4 27.3 27.8 28.3 29.3 0.3 0.6  
31.6 31.2 31.2 32.2 32.7 33.2 34.2 0.4 0.8  
38 37.6 37.6 38.6 39.1 39.6 40.6 0.4 0.8  
■FH30 Series Recommended FPC Construction  
Material Thickness  
(μm)  
1. Using Single-sided FPC  
Material Name  
Material  
1 mil thick  
Covering film layer  
Cover adhesive  
Polyimide  
(25)  
(25)  
3
0.2μm thick gold plated over 1 to  
5μm thick nickel underplating  
Surface treatment  
Copper foil  
Base adhesive  
Base film  
Cu  
Thermosetting adhesive  
Polyimide 1 mil thick  
1oz  
35  
25  
25  
Reinforcement material adhesive Thermosetting adhesive  
30  
Stiffener  
Polyimide  
Total  
7 mil thick  
175  
293  
Material Thickness  
(μm)  
2. Using Double-sided FPC  
Material Name  
Material  
1 mil thick  
Covering layer film  
Cover adhesive  
(25)  
(25)  
3
Polyimide  
0.2μm thick gold plated over 1 to  
5μm thick nickel underplating  
Surface treatment  
Through-hole copper  
Copper foil  
Cu  
15  
18  
Cu  
Thermosetting adhesive  
Polyimide 1 mil thick  
Thermosetting adhesive  
Cu 1/2oz  
Thermosetting adhesive  
Polyimide 1 mil thick  
1/2oz  
Base adhesive  
Base film  
18  
25  
Base adhesive  
Copper foil  
18  
(18)  
25  
Cover adhesive  
Covering film layer  
25  
50  
Reinforcement material adhesive Thermosetting adhesive  
100  
Stiffener  
Polyimide  
Total  
4 mil thick  
297  
* To prevent release of the FPC due to it’s bending, use of the double-sided FPC with copper foil on the back side is NOT RECOMMENDED.  
3. Precautions  
1. This specification is a recommendation for the construction of the FH30 Series FPC (t=0.3 0.05).  
2. For details about the construction, please contact the FPC manufacturers.  
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