Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA=25°C, unless otherwise specified.
Symbol
VS
Characteristics
High-Side Offset Voltage
Min.
VB-25
-0.3
Max.
VB+0.3
625
Unit
VB
High-Side Floating Supply Voltage
High-Side Floating Output Voltage
Logic Fixed Supply Voltage
Logic Input Voltage
VHO
VS-0.3
-0.3
VB+0.3
25
V
VCC
VIN
-0.3
VCC+0.3
± 50
dVS/dt
Allowable Offset Voltage Slew Rate
Power Dissipation
V/ns
W
(2)(3)(4)
PD
0.625
200
θJA
TJ
Thermal Resistance, Junction-to-Ambient
Junction Temperature
°C/W
°C
+150
+150
+125
TS
TA
Storage Temperature
°C
Ambient Temperature
-40
°C
Notes:
2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
3. Refer to the following standards:
JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
4. Do not exceed PD under any circumstances.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VB
Parameter
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Min.
VS+10
6-VCC
VS
Max.
VS+20
600
Unit
VS
VHO
VIN
VB
V
Logic Input Voltage
GND
10
VCC
20
VCC
Logic Supply Voltage
© 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
www.fairchildsemi.com
4