Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are
absolute voltages referenced to COM.
Parameter
Symbol
Min.
Max.
Unit
High side floating supply offset voltage
High side floating supply voltage
High side floating output voltage
Supply voltage
VS
VB
VB-25
-0.3
VB+0.3
625
V
V
VHO
VCC
VIN
Vs-0.3
-0.3
VB+0.3
25
V
V
Input voltage for IN
-0.3
Vcc+0.3
Vcc+0.3
0.625
200
V
Input voltage forRESET
VRESET
Pd
-0.3
V
Power Dissipation 1)
W
°C/W
V
Thermal resistance, junction to ambient1)
Rthja
VESD
Electrostatic discharge voltage
(Human Body Model)
1K
Charge device model
Junction Temperature
Storage Temperature
VCDM
Tj
500
V
150
150
°C
°C
TS
-55
Note: 1) The thermal resistance and power dissipation rating are measured bellow conditions;
JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions - Natural convection(StillAir)
JESD51-3 : Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Package
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.-40°C <= Ta<= 125 °C
Parameter
Symbol
Min.
Max.
Unit
High side floating supply voltage
-10V Transient 0.2us
VB
Vs + 10
Vs + 20
V
V
V
High side floating supply offset voltage(DC)
VS
VS
-5
600
600
High side floating supply offset voltage(Transient)
-25 (~200ns)
-20(200ns~240ns)
-7(240ns~400ns)
High side floating output voltage
Allowable offset voltage Slew Rate1)
Supply voltage
VHO
dv/dt
VCC
VIN
Vs
-
VB
50
V
V/ns
V
10
0
20
Input voltage for IN
Vcc
Vcc
200
125
V
Input voltage forRESET
Switching Frequency 2)
Ambient Temperature
VRESET
Fs
0
V
KHz
°C
Ta
-40
Note : 1) Guaranteed by design.
2) Duty = 0.5
3
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FAN7083_F085 Rev. 1.0.2