Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are abso-
lute voltages referenced to COM.
Parameter
High side floating supply offset voltage
High side floating supply voltage
High side floating output voltage
Low side output voltage
Symbol
VS
Min.
VB-25
-0.3
Max.
VB+0.3
625
Unit
V
VB
V
VHO
VLO
VCC
VIN
Vs-0.3
-0.3
VB+0.3
VCC + 0.3
25
V
V
Supply voltage
-0.3
V
Input voltage for IN
-0.3
Vcc+0.3
+1
V
Input injection current. Full function, no latch
up;(Guaranteed by design). Test at 10V and
17V on Eng.Samples
IIN
-
mA
Power Dissipation
Pd
0.625
200
W
°C/W
V
Thermal resistance, junction to ambient
Rthja
Electrostatic discharge voltage
(Human Body Model)
V
1K
ESD
Charge device model
Junction Temperature
Storage Temperature
V
500
V
CDM
Tj
150
150
°C
°C
T
-55
S
Note: 1) The thermal resistance and power dissipation rating are measured bellow conditions;
JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions - Natural convection(StillAir)
JESD51-3 : Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Package
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Parameter
Symbol
Min.
Max.
Unit
1)
High side floating supply voltage(DC)
Transient:-10V@ 0.1 us
VB
VS + 6
VS + 20
V
High side floating supply offset voltage(DC)
Transient: -25V(max) @0.1us @VBS<25V
VS
-5
600
V
High side floating output voltage
Low side output voltage
VHO
VLO
dv/dt
VCC
VIN
Fs
Vs
0
VB
VCC
50
V
V
2)
Allowable offset voltage Slew Rate
-
V/ns
V
Supply voltage for logic part
Logic input voltage
5.5
0
20
Vcc
200
125
V
3)
Switching Frequency
KHz
°C
Ambient Temperature
Ta
-40
Note: 1) The Vs offset is tested with all supplies biased at 15V differential.
2) Guaranteed by design.
3) When VDT= 1.2V.
3
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FAN7080_GF085 Rev. 1.0.0