Anti-Sulfurated Thick Film Chip Resistors
■ Packaging Methods (Taping)
● Standard Quantity
Type
ERJS02
Kind of Taping
Pitch (P1)
2 mm
Quantity
10000 pcs./reel
ERJS03
Punched Carrier Taping
Embossed Carrier Taping
ERJS06
ERJS08
ERJS14
ERJS12
ERJS1D
ERJS1T
5000 pcs./reel
4000 pcs./reel
4 mm
● Carrier Tape
(Unit : mm)
Punched Carrier
Embossed Carrier
P1
P2
P0
φD0
P1 (2 mm pitch)
T
A
T
φD1 (Only Emboss)
Type
A
0.70
1.10
1.65
2.00
2.80
3.50
2.80
3.60
B
W
F
E
P1
2.00
P2
P0
D
T
0.52
0.70
0.84
D
φ
1
φ
0
0.05
0.10
0.15
0.15
0.20
0.20
0.20
0.20
0.05
0.10
0.20
0.20
0.20
0.20
0.20
0.20
0.10
0.10
0.05
0.05
0.05
ERJS02
ERJS03
ERJS06
ERJS08
ERJS14
ERJS12
ERJS1D
ERJS1T
1.20
1.90
2.50
3.60
3.50
4.80
5.30
6.90
—
—
—
—
0.20
8.00
0.05
0.20
3.50
0.10
0.05
0.10
+0.10
−0
1.75
2.00
4.00
1.50
0.30
0.30
8.00
4.00
+0.10
1.0
−0
0.10
1.00
12.00
5.50
1.5 min.
● Taping Reel
(Unit : mm)
T
Type
A
B
C
φ
W
φ
φ
T
ERJS02
ERJS03
ERJS06
ERJS08
ERJS14
ERJS12
ERJS1D
ERJS1T
1.0
1.0
9.0
11.4
φC
+0
–3.0
1.0
180.0
60 min. 13.0
1.0
2.0
13.0
15.4
φA
W
■ Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Dimensions (mm)
Type
(inches)
a
b
c
Chip Resistor
ERJS02(0402) 0.5 to 0.6
ERJS03(0603) 0.7 to 0.9
1.4 to 1.6
0.4 to 0.6
0.8 to 1
2 to 2.2
3.2 to 3.8
4.4 to 5
ERJS06(0805)
ERJS08(1206)
ERJS14(1210)
1 to 1.4
2 to 2.4
2 to 2.4
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
2.3 to 3.5
a
b
4.4 to 5
ERJS12(1812) 3.3 to 3.7
5.7 to 6.5
6.2 to 7
ERJS1D(2010)
ERJS1T(2512)
3.6 to 4
5 to 5.4
7.6 to 8.6
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006