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EPM1270T100C PDF预览

EPM1270T100C

更新时间: 2022-12-18 00:40:44
品牌 Logo 应用领域
阿尔特拉 - ALTERA /
页数 文件大小 规格书
86页 1216K
描述
MAX II Device Family

EPM1270T100C 数据手册

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Chapter 1: Introduction  
1–3  
Features  
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA, and  
thin quad flat pack (TQFP) packages (refer to Table 1–3 and 1–3). MAX II devices  
support vertical migration within the same package (for example, you can migrate  
between the EPM570, EPM1270, and EPM2210 devices in the 256-pin FineLine BGA  
package). Vertical migration means that you can migrate to devices whose dedicated  
pins and JTAG pins are the same and power pins are subsets or supersets for a given  
package across device densities. The largest density in any package has the highest  
number of power pins; you must lay out for the largest planned density in a package  
to provide the necessary power pins for migration. For I/O pin migration across  
densities, cross reference the available I/O pins using the device pin-outs for all  
planned densities of a given package type to identify which I/O pins can be migrated.  
®
The Quartus II software can automatically cross-reference and place all pins for you  
when given a device migration list.  
Table 1–3. MAX II Packages and User I/O Pins  
68-Pin  
Micro  
100-Pin  
Micro  
144-Pin  
Micro  
256-Pin  
Micro  
100-Pin  
256-Pin  
324-Pin  
FineLine FineLine FineLine 100-Pin 144-Pin FineLine  
FineLine FineLine FineLine  
Device  
EPM240  
BGA (1)  
BGA (1)  
BGA (1)  
TQFP  
TQFP  
BGA (1)  
BGA (1)  
BGA  
BGA  
80  
80  
80  
EPM240G  
EPM570  
76  
76  
76  
116  
116  
160  
212  
160  
212  
204  
EPM570G  
EPM1270  
EPM1270G  
EPM2210  
EPM2210G  
EPM240Z  
EPM570Z  
Note to Table 1–3:  
272  
54  
80  
76  
116  
160  
(1) Packages available in lead-free versions only.  
Table 1–4. MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes  
68-Pin  
Micro  
100-Pin  
Micro  
144-Pin  
Micro  
256-Pin  
Micro  
100-Pin  
256-Pin  
324-Pin  
FineLine FineLine FineLine 100-Pin 144-Pin FineLine FineLine FineLine FineLine  
Package  
Pitch (mm)  
Area (mm2)  
BGA  
BGA  
BGA  
TQFP  
TQFP  
BGA  
BGA  
BGA  
BGA  
0.5  
0.5  
1
0.5  
0.5  
0.5  
0.5  
1
1
25  
36  
121  
256  
484  
49  
121  
289  
361  
Length × width  
(mm × mm)  
5 × 5  
6 × 6  
11 × 11  
16 × 16 22 × 22  
7 × 7  
11 × 11  
17 × 17  
19 × 19  
© October 2008 Altera Corporation  
MAX II Device Handbook  

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