EPA030D
UPDATED 11/30/2004
High Performance Heterojunction Dual-Gate FET
FEATURES
•
•
•
•
•
+18.0 dBm OUTPUT POWER AT 1dB COMPRESSION
19.5 dB POWER GAIN AT 12GHz
0.3 x 300 MICRON RECESSED “MUSHROOM” DUAL GATE
Si3N4 PASSIVATION
ADVANCED EPITAXIAL DOPING PROFILE PROVIDES
EXTRA HIGH PERFORMANCE AND HIGH RELIABILITY
MIXER, SWITCH, AGC AND TEMPERATURE
COMPENSATION APPLICATIONS
•
•
Idss SORTED IN 5mA PER BIN RANGE
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
Caution! ESD sensitive device.
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
SYMBOL
PARAMETERS/TEST CONDITIONS1
MIN
15.0
17.5
TYP
18.0
19.5
1.2
MAX
UNITS
dBm
dB
Output Power at 1dB Compression
P1dB
VDS = 6V, IDS ≈ 50% IDSS, VG2S = 0V
f = 12GHz
f = 12GHz
f = 12GHz
f = 12GHz
Gain at 1dB Compression
VDS = 6V, IDS ≈ 50% IDSS, VG2S = 0V
G1dB
NF
Noise Figure
DS = 3V, IDS ≈ 15mA, VG2S = 0V
dB
V
Associated Gain
VDS = 3V, IDS ≈ 15mA, VG2S = 0V
dB
Ga
17.5
mA
mS
V
IDSS
GM
Saturated Drain Current
Transconductance
Pinch-off Voltage
V
DS = 3V, VG1S = VG2S = 0 V
30
40
80
70
115
V
DS = 3V, VG1S = -0.5V, VG2S = 0 V
VP1
VP2
V
V
DS = 3V, IDS = 1.0mA, VG2S = 0 V
DS = 3V, IDS = 1.0mA, VG1S = 0 V
-1.5
-1.5
-3.5
-3.5
V
Pinch-off Voltage
Gate 2 to Drain Breakdown Voltage
G2D = 1.0mA, Gate 1 Open
Gate 1 to Source Breakdown Voltage
G1S = 1.0mA, Gate 2 Open
V
BVG2D
-10
-6
-14
I
V
BVG1S
RTH
-12
I
oC/W
Thermal Resistance
125
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 1 of 2
Revised December 2004