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EP2S90F1508C5 PDF预览

EP2S90F1508C5

更新时间: 2024-02-10 23:46:51
品牌 Logo 应用领域
英特尔 - INTEL 现场可编程门阵列可编程逻辑
页数 文件大小 规格书
248页 2983K
描述
Field Programmable Gate Array, 36384 CLBs, 640MHz, 90960-Cell, CMOS, PBGA1508, 40 X 40 MM, 1 MM PITCH, FBGA-1508

EP2S90F1508C5 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:BGA, BGA1020,32X32,40Reach Compliance Code:compliant
ECCN代码:3A001.A.7.AHTS代码:8542.39.00.01
风险等级:5.23最大时钟频率:717 MHz
CLB-Max的组合延迟:5.117 nsJESD-30 代码:S-PBGA-B1020
JESD-609代码:e1长度:33 mm
湿度敏感等级:3可配置逻辑块数量:6627
输入次数:742逻辑单元数量:132540
输出次数:734端子数量:1020
最高工作温度:100 °C最低工作温度:-40 °C
组织:6627 CLBS封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA1020,32X32,40
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):245电源:1.2,1.5/3.3,3.3 V
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:3.5 mm子类别:Field Programmable Gate Arrays
最大供电电压:1.25 V最小供电电压:1.15 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:33 mm
Base Number Matches:1

EP2S90F1508C5 数据手册

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Contents  
Stratix II Device Handbook, Volume 1  
Open-Drain Output ........................................................................................................................ 2–84  
Bus Hold .......................................................................................................................................... 2–84  
Programmable Pull-Up Resistor .................................................................................................. 2–85  
Advanced I/O Standard Support ................................................................................................ 2–85  
On-Chip Termination .................................................................................................................... 2–89  
MultiVolt I/O Interface ................................................................................................................. 2–93  
High-Speed Differential I/O with DPA Support ............................................................................ 2–96  
Dedicated Circuitry with DPA Support .................................................................................... 2–100  
Fast PLL & Channel Layout ........................................................................................................ 2–102  
Document Revision History ............................................................................................................. 2–104  
Chapter 3. Configuration & Testing  
IEEE Std. 1149.1 JTAG Boundary-Scan Support ............................................................................... 3–1  
SignalTap II Embedded Logic Analyzer ............................................................................................ 3–4  
Configuration ......................................................................................................................................... 3–4  
Operating Modes .............................................................................................................................. 3–5  
Configuration Schemes ................................................................................................................... 3–7  
Configuring Stratix II FPGAs with JRunner ............................................................................... 3–10  
Programming Serial Configuration Devices with SRunner ..................................................... 3–10  
Configuring Stratix II FPGAs with the MicroBlaster Driver ................................................... 3–11  
PLL Reconfiguration ...................................................................................................................... 3–11  
Temperature Sensing Diode (TSD) ................................................................................................... 3–11  
Automated Single Event Upset (SEU) Detection ............................................................................ 3–13  
Custom-Built Circuitry .................................................................................................................. 3–14  
Software Interface ........................................................................................................................... 3–14  
Document Revision History ............................................................................................................... 3–14  
Chapter 4. Hot Socketing & Power-On Reset  
Stratix II  
Hot-Socketing Specifications ............................................................................................................... 4–1  
Devices Can Be Driven Before Power-Up .................................................................................... 4–2  
I/O Pins Remain Tri-Stated During Power-Up ........................................................................... 4–2  
Signal Pins Do Not Drive the VCCIO, VCCINT or VCCPD Power Supplies .................................... 4–2  
Hot Socketing Feature Implementation in Stratix II Devices .......................................................... 4–3  
Power-On Reset Circuitry .................................................................................................................... 4–5  
Document Revision History ................................................................................................................. 4–6  
Chapter 5. DC & Switching Characteristics  
Operating Conditions ........................................................................................................................... 5–1  
Absolute Maximum Ratings ........................................................................................................... 5–1  
Recommended Operating Conditions .......................................................................................... 5–2  
DC Electrical Characteristics .......................................................................................................... 5–3  
I/O Standard Specifications ........................................................................................................... 5–4  
Bus Hold Specifications ................................................................................................................. 5–17  
On-Chip Termination Specifications ........................................................................................... 5–17  
Pin Capacitance .............................................................................................................................. 5–19  
Power Consumption ........................................................................................................................... 5–20  
iv  
Altera Corporation  

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