Datasheet > EB51F5G30DV-10.000M

EB51F5G30DV-10.000M

更新时间： 2024-01-24 05:34:35

品牌	Logo	应用领域
日蚀 - ECLIPTEK		/
页数	文件大小	规格书
4页	117K
描述
OSCILLATORS 3.0PPM -30+75 5.0V 4 10.000MHZ CMOS 10% FULL 14PIN DIP

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数据手册

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EB51F5G30DV-10.000M 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.79	Is Samacsys：	N
Base Number Matches：	1

EB51F5G30DV-10.000M 数据手册

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EB51F5G30DV-10.000M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

30 - 60 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

245°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

245°C Maximum 1 Time / 235°C Maximum 2 Times

5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4

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