是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | TQFP, TQFP44,.47SQ,32 | 针数: | 44 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 11 weeks |
风险等级: | 0.81 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 16 | |
边界扫描: | YES | CPU系列: | DSPIC33 |
DAC 通道: | YES | DMA 通道: | YES |
外部数据总线宽度: | 格式: | FLOATING POINT | |
集成缓存: | NO | JESD-30 代码: | S-PQFP-G44 |
JESD-609代码: | e3 | 长度: | 10 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
DMA 通道数量: | 8 | 外部中断装置数量: | 3 |
I/O 线路数量: | 35 | 串行 I/O 数: | 2 |
端子数量: | 44 | 计时器数量: | 5 |
片上数据RAM宽度: | 16 | 片上程序ROM宽度: | 24 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TQFP | 封装等效代码: | TQFP44,.47SQ,32 |
封装形状: | SQUARE | 封装形式: | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
认证状态: | Not Qualified | RAM(字节): | 4096 |
RAM(字数): | 2048 | ROM(单词): | 10922 |
ROM可编程性: | FLASH | 座面最大高度: | 1.2 mm |
速度: | 40 MHz | 子类别: | Digital Signal Processors |
最大压摆率: | 76 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 3 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.8 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 10 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DSPIC33FJ32MC304T-I/PT | MICROCHIP |
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16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP44, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTI |
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DSPIC33FJ32MC304T-H/PT | MICROCHIP |
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16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP44, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTI |
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