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DSPIC33FJ128MC506ATE/MR PDF预览

DSPIC33FJ128MC506ATE/MR

更新时间: 2024-01-24 19:23:33
品牌 Logo 应用领域
美国微芯 - MICROCHIP 闪存
页数 文件大小 规格书
80页 943K
描述
16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC64, 9 X 9 MM, 0.90 MM HEIGHT, 0.50 MM, LEAD FREE, PLASTIC, QFN-64

DSPIC33FJ128MC506ATE/MR 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:QFN
包装说明:9 X 9 MM, 0.90 MM HEIGHT, 0.50 MM, LEAD FREE, PLASTIC, QFN-64针数:64
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.17
Is Samacsys:N具有ADC:YES
地址总线宽度:位大小:16
最大时钟频率:40 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:
格式:FLOATING-POINTJESD-30 代码:S-PQCC-N64
JESD-609代码:e3长度:9 mm
湿度敏感等级:1I/O 线路数量:53
端子数量:64最高工作温度:125 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装等效代码:LCC64,.35SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
RAM(字数):4096ROM可编程性:FLASH
座面最大高度:1 mm速度:40 MHz
子类别:Digital Signal Processors最大压摆率:90 mA
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:9 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

DSPIC33FJ128MC506ATE/MR 数据手册

 浏览型号DSPIC33FJ128MC506ATE/MR的Datasheet PDF文件第2页浏览型号DSPIC33FJ128MC506ATE/MR的Datasheet PDF文件第3页浏览型号DSPIC33FJ128MC506ATE/MR的Datasheet PDF文件第4页浏览型号DSPIC33FJ128MC506ATE/MR的Datasheet PDF文件第5页浏览型号DSPIC33FJ128MC506ATE/MR的Datasheet PDF文件第6页浏览型号DSPIC33FJ128MC506ATE/MR的Datasheet PDF文件第7页 
dsPIC33F/PIC24H  
dsPIC33F/PIC24H Flash Programming Specification  
• PIC24HJ128GP306  
1.0  
DEVICE OVERVIEW  
• PIC24HJ128GP310  
This document defines the programming specification  
for the dsPIC33F 16-bit Digital Signal Controller (DSC)  
and PIC24H 16-bit Microcontroller (MCU) families. This  
programming specification is required only for those  
developing programming support for the dsPIC33F/  
PIC24H family. Customers only using one of these  
devices should use development tools that already  
provide support for device programming.  
• PIC24HJ128GP506  
• PIC24HJ128GP510  
• PIC24HJ256GP206  
• PIC24HJ256GP210  
• PIC24HJ256GP610  
• dsPIC33FJ12GP201  
• dsPIC33FJ12GP202  
• dsPIC33FJ12MC201  
• dsPIC33FJ12MC202  
• PIC24HJ12GP201  
• PIC24HJ12GP202  
This document includes programming specifications  
for the following devices:  
• dsPIC33FJ64GP206  
• dsPIC33FJ64GP306  
• dsPIC33FJ64GP310  
• dsPIC33FJ64GP706  
• dsPIC33FJ64GP708  
• dsPIC33FJ64GP710  
• dsPIC33FJ128GP206  
• dsPIC33FJ128GP306  
• dsPIC33FJ128GP310  
• dsPIC33FJ128GP706  
• dsPIC33FJ128GP708  
• dsPIC33FJ128GP710  
• dsPIC33FJ256GP506  
• dsPIC33FJ256GP510  
• dsPIC33FJ256GP710  
• dsPIC33FJ64MC506  
• dsPIC33FJ64MC508  
• dsPIC33FJ64MC510  
• dsPIC33FJ64MC706  
• dsPIC33FJ64MC710  
• dsPIC33FJ128MC506  
• dsPIC33FJ128MC510  
• dsPIC33FJ128MC706  
• dsPIC33FJ128MC708  
• dsPIC33FJ128MC710  
• dsPIC33FJ256MC510  
• dsPIC33FJ256MC710  
• PIC24HJ64GP206  
2.0  
PROGRAMMING OVERVIEW  
OF THE dsPIC33F/PIC24H  
There are two methods of programming the dsPIC33F/  
PIC24H family of devices discussed in this  
programming specification. They are:  
• In-Circuit Serial Programming™ (ICSP™)  
programming capability  
• Enhanced In-Circuit Serial Programming  
The ICSP programming method is the most direct  
method to program the device; however, it is also the  
slower of the two methods. It provides native, low-level  
programming capability to erase, program and verify  
the chip.  
The Enhanced ICSP protocol uses a faster method that  
takes advantage of the programming executive, as  
illustrated in Figure 2-1. The programming executive  
provides all the necessary functionality to erase, pro-  
gram and verify the chip through a small command set.  
The command set allows the programmer to program  
the dsPIC33F/PIC24H Programming Specification  
devices without having to deal with the low-level  
programming protocols of the chip.  
• PIC24HJ64GP210  
• PIC24HJ64GP506  
• PIC24HJ64GP510  
• PIC24HJ128GP206  
• PIC24HJ128GP210  
© 2007 Microchip Technology Inc.  
Preliminary  
DS70152D-page 1  

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